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活动简介

ICICM-International Conference on Integrated Circuits and Microsystems is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. This conference provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration. The previous 2 editions ICICM were sponsored by IEEE and it has been successfully held in Chengdu on November 23-25, 2016 and Nanjing on November 8-11, 2017. The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018) will be held on November 24-26, 2018 in Shanghai, China with the support from University of Electronic Science and Technology of China and Southeast University, China.

征稿信息

重要日期

2018-08-20
初稿截稿日期
2018-09-10
初稿录用日期
2018-11-05
终稿截稿日期

征稿范围

Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS

Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

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重要日期
  • 会议日期

    11月24日

    2018

    11月26日

    2018

  • 08月20日 2018

    初稿截稿日期

  • 09月10日 2018

    初稿录用通知日期

  • 11月05日 2018

    终稿截稿日期

  • 11月26日 2018

    注册截止日期

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