活动简介
This new conference will be held in China to provide an international forum according to IEEE standard for the presentation and exchange of the latest technical achievements and cross-discipline fertilization of IC designs, technologies, and applications in our fast-changing society.
China is becoming a semiconductor hub for academia, industry and market. However, young Chinese researchers, in particular students, lack the opportunity to attend IEEE conferences. International counterparts also wish to experience firsthand the fast-growing semiconductor sector in China. To this end, ICTA was founded by a group of Chinese scholars and will be held annually in China. It will be a broad yet advanced forum for IC designs, technologies and applications worldwide.
组委会
General Chair:
Nanning Zheng, XJTU, China
TPC Co-Chairs:
Zhiyi Yu, Sun Yat-sen U., China
Xiaoyan Gui, XJTU, China
Steering Committee Members:
Dixian Zhao (Chair), Southeast U.
Zhihua Wang, Tsinghua, China
Fujiang Lin, USTC, China
Nanjian Wu, IS-CAS, China
Liyuan Liu, IS-CAS, China
International Advisors:
Jan Van der Spiegel, U. Penn, USA
Christian Enz, EPFL, Switzerland
Yann Deval, U. Bordeaux, France
Hoi-Jun Yoo, KAIST, Korea
Yong Lian, IEEE CASS, USA
Ke Wu, IEEE MTT-S, Canada
Albert Wang, IEEE EDS, USA
Makoto Ikeda, U. of Tokyo. Japan
James Hwang，Lehigh U. USA
Local Arrangement Chair:
Li Geng, XJTU, China
Invited Program Chair:
Haiding Sun, USTC, China
Tutorial Chair:
Bo Zhao, Zhejiang U., China
Keynote Speakers Chair:
Lin Cheng, USTC, China
Industry Papers Chair:
Maliang Liu , XDU., China
Student Papers Chair:
Hongbin Sun, XJTU, China
Xian Tang, Tsinghua, China
Program/Sessions Chair:
Weiwei Shan, SEU, China
Awards Committee Chair:
Zheng Wang, UESTC, China
Publication/Booklet Chair:
Ying Zhang, BJAST, China
Website Chair:
Qing Wu, BIE, China
Finance Chair:
Jiayue Zhang, BIE, China
Sponsorship/Exhibition Chair
Dan Li, XJTU,China
Conference Secretariat:
Xiaohan Zhang, BIE, China
征稿信息
重要日期
The 5th IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA 2022), will be held on October, 2022 in Xi’an, China. This new conference will be held in China to provide an international forum according to IEEE standard for the presentation and exchange of the latest technical achievements and cross-discipline fertilization of IC designs, technologies, and applications in our fast-changing society. This year’s theme is “Integrated Circuits and Systems for Intelligent & 6G Society”.
征稿范围
Topics include, but are not limited to, the following technical areas:
1. RFIC and MMIC: Si-based RFIC building-block circuit, compound-semiconductor-based MMIC building-block circuit, LNA, PA, VCO, PLL, phase shifter, mixer, RF switch, balun, driver amplifier, transceiver, etc.
2. Analog and Mixed-Signal ICs: power management and energy harvesting device and system, amplifier, comparator, filter, AGC, VGA, ADC, DAC, etc.
3. Digital ICs and Memory: SoC, processor, FPGA, AI and deep-learning processor, DSP, NoC, memory, etc.
4. Wireline ICs: high-speed data link, optical transceiver, SerDes, CDRs, equalizer, modulator, etc.
5. Modeling, EDA and Testing: compact models and extraction techniques (silicon based), SPICE models and extraction techniques (non-silicon), modeling technique of GaN, SiC, ASM-HEMT, 2D-material-based devices, quantum devices, test structures design and model parameter extraction, RF calibration and reliable data acquisition, CAD, EM/TCAD simulation, co-simulation and verification technique, PDK validation, etc.
6. Device and Process Technologies: CMOS, FinFET, junctionless device, negative capacitance device, UT-SOI, LDMOS, HEMT, HBT, SiGe, GaAs, InP, GaN, 3rd generation materials, MEMS, device characterization, device FAR, 3D integration, TSV, etc.flash, OPT, MPT, SRAM, DRAM, 3D NAND, MRAM, RRAM, PCRAM, FeRAM, crossbar, DRAM+MCU, etc.
7. Packaging and Hybrid Integration: Active antenna, EM field, filters, Hybrid MIC, MCM, SiP, SoP, TSV, flip chip assembly, wire bonding, anisotropic conductive film, interconnection technologies, multi-physics and multiscale EM computation/simulation, 3D packaging, etc.
8. Sensors and Applications: MEMS sensors, image sensors, physical sensors, chemical sensors, bio-sensors, smart and intelligent sensors, sensor interface, sensor technology and applications, etc.
9. IC Based Applications: IC based module and system integration, automotive electronics, automotive radar, 5G systems, AI systems, IoTs, healthcare and biomedical systems, etc.
10. Emerging Technologies and Applications: 2D materials, green and implantable materials, neuromorphic device, optoelectronic device, device characterization, etc.
11. Intelligent Robots: robot kinematics/dynamics/control, system integration, AI in robotics, sensor/actuator, bio-inspired systems, robot perception, human robot interaction, and robot vision, etc.
作者指南
To encourage timely reporting of the latest results and to have better opportunities to expand papers for possible journal publications, prospective authors are invited to submit a 2-page paper (both initial submission and final version, if accepted) in English and in IEEE Xplore PDF format. The paper should emphasize original contributions and key findings, including figures, diagrams and results from verified simulations with direct or indirect measurements. Up to 2 additional pages of figures supporting initial submission which will not in final publication are encouraged. References should be clearly cited and up-to-date. Invited papers can extend up to 6 pages submission. By submitting the paper, the authors promise that, if accepted, at least one of them will attend ICTA 2022 with full registration.
全部留言
重要日期
-
会议日期
10月28日
2022
至10月30日
2022
-
08月01日 2022
摘要截稿日期
-
09月05日 2022
摘要录用通知日期
-
09月20日 2022
终稿截稿日期
-
10月30日 2022
注册截止日期
主办单位
IEEE SSCS Guangzhou Chapter
Guangzhou Branch, the Chinese Academy of Sciences
IEEE EDS Beijing Chapter
IEEE MTT-S NanJing Chapter
联系方式
- co******@ieee-icta.net
- +86********
留言