活动简介

This new conference will be held in China to provide an international forum according to IEEE standard for the presentation and exchange of the latest technical achievements and cross-discipline fertilization of IC designs, technologies, and applications in our fast-changing society.
Sponsor Type:5; 9

征稿信息

重要日期

2021-08-02
初稿截稿日期
2021-09-06
初稿录用日期

征稿范围

ICTA 2021 welcomes papers of new and innovative discoveries and designs on:
RFIC and MMIC
Analog and Mixed-Signal ICs
Digital ICS and Memory
Wireline ICS
Modeling, CAD and Testing
​Device and Process Technologies​Packaging and Hybrid Integration
Emerging Technologies and Applications
Sensors and Applications
IC Based Applications
Intelligent Robot
 

作者指南

1. Read the Author Information page to ensure that your submission meets the guidelines.

2. Prepare your submission in PDF format using our templates.

3. View the Track List

4. You will need each author's information (email, affiliation, etc) to complete the submission process. Have this information ready before proceeding. 

  1. IEEE takes the protection of intellectual property seriously. Accordingly, all submissions will be screened for plagiarism. By submitting your work you agree to allow IEEE to screen your work. 

IEEE reserves the right to exclude any accepted paper from distribution after the conference (including, removal from IEEE Xplore) if the accepted paper is not presented at the conference.

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重要日期
  • 会议日期

    11月24日

    2021

    11月26日

    2021

  • 08月02日 2021

    初稿截稿日期

  • 09月06日 2021

    初稿录用通知日期

  • 11月26日 2021

    注册截止日期

主办单位
Beijing Institute of Electronics Nanjing Section AP/MTT/EMC Joint Chapter
联系方式
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