报告详情
Evaluation of the Insulation Performance of the Disconnector to Ground Based on MD
编号：68
访问权限：仅限参会人
更新：2022-08-29 11:02:01 浏览：80次
口头报告
摘要
Epoxy resin materials are selected as the main material of disconnector to ground insulation. In this paper, the molecular model of epoxy resin was built based on molecular simulation technology, and the effects of different electric fields on the thermodynamic, mechanical and dielectric properties of epoxy resins were studied from the microscopic level. The results showed that the glass transition temperature decreased by 55K as electric field reached 0.06V/nm. Higher electric field led to the increase of the thermal conductivity, but the rate gradually decreased as electric field increased. The mechanical properties including Young's modulus, volume modulus and shear modulus decreased by 18.01%, 14.38% and 20.10% respectively when the electric field strength reached its maximum The epoxy resin under high electric field presented higher relative permittivity. At the same time, the increase of the electric field changed the microstructure of epoxy resin, the cohesive energy density decreased and the free volume fraction increased.
关键词
EPOXY RESIN,MOLECULAR DYNAMICS,THERMODYNAMIC PROPERTIES,MECHANICAL PROPERTIES,DIELECTRIC PROPERTIES
报告人
Lujia Wang
China University of Mining and Technology稿件作者
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重要日期
-
会议日期
09月25日
2022
至09月29日
2022
-
08月15日 2022
提前注册日期
-
09月10日 2022
报告提交截止日期
-
11月10日 2022
注册截止日期
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11月30日 2022
初稿截稿日期
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11月30日 2022
终稿截稿日期
主办单位
IEEE DEIS
承办单位
Chongqing University
联系方式
- Zhengyong Huang
- 61******@qq.com
历届会议
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2020年09月06日 中国 Beijing
2020 IEEE International Conference on High Voltage Engineering and Application -
2018年09月10日 希腊
2018 IEEE International Conference on High Voltage Engineering and Application -
2016年09月19日 中国 Chengdu, China
2016 IEEE International Conference on High Voltage Engineering and Application
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