会议简介

The 2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE 2020) will be held in Beijing, September 6-10, 2020.   After six successful conferences held in Chongqing, China (2008), New Orleans, USA (2010), Shanghai, China (2012), Poznan, Poland (2014), Chengdu, China (2016) and Athens, Greece (2018), ICHVE has been established as reference point for the exchange of knowledge and experiences in High Voltage and Power engineering. On behalf of the Organizing Committee, we are honored to welcome you to attend ICHVE 2020, which is organized by Tsinghua University, Beijing, China and endorsed by IEEE Dielectrics and Electrical Insulation Society. Tsinghua University is one of the most prestigious universities in China. Through teaching, research and innovation, Tsinghua is committed to the advancement and well-being of the nation and the world. Beijing was selected to host the ICHVE2020 because of its fabulous facilities and excellent business climate, and also because it is the world most vibrant city both in economic and technology development with rich cultures, modern &  historical landmarks. So come and join ICHVE 2020 in Beijing in 2020! We will offer a rich scientific program of highest quality with invited speakers from all over the world and provide a broad forum of exchange for both academia and industry alike.   The symposium will cover the entire scope of High Voltage Engineering. Prospective authors are invited to submit original papers on their latest research results.

组委会

Conference Chairman

Jinliang He Tsinghua University, China hejl@tsinghua.edu.cn

Technical Program Chair

Rong Zeng Tsinghua University, China zengrong@tsinghua.edu.cn

Organizing Committee  Chair

Bo Zhang Tsinghua University, China shizbcn@tsinghua.edu.cn

Publication Committee

Zhanqing Yu yzq@tsinghua.edu.cn Qi Li qili1020@tsinghua.edu.cn  

Finance

Junting Du eme7@tsinghua.edu.cn

Conference and Exhibition Management

Jun Hu hjun@tsinghua.edu.cn

Symposium Secretariat

Chijie Zhuang chijie@tsinghua.edu.cn

征稿简介

Abstracts submission: www.conftool.org/ichve2020/ 

Authors are requested to submit the abstracts with 300-400 words at: https://www.conftool.org/ichve2020/, outlining the relevance and the originality of their works. Authors of accepted abstracts will be invited to present their full papers. The manuscript length should be 4 pages. No hardcopies will be accepted. The paper should be written using a proper English language. All papers must be unpublished and should not be under simultaneous reviewed for any other conferences or workshops or journals.

Accepted Papers

Notifications of paper acceptance and the necessary information to electronically submit the final version of the paper will be sent to the authors. Final papers shall be no more than 4 pages including figures, tables and references. One of the authors of each paper must have full registration and present the paper in person at the Conference. The conference proceedings will be submitted to the IEEE Xplore® digital library. 

Important Dates

Deadline for abstract submission:   March 31, 2020

Notification of abstract acceptance:   March 15, 2020

Deadline for full paper submission:    May 30, 2020

Notification of full paper acceptance:  July 15, 2020

Final manuscript, camera ready: August 10, 2020

征稿范围

1. Electromagnetic Fields
2. Transients, Grounding Systems, and EMC
3. Sensing, Monitoring and Diagnostics
4. High Voltage Testing and Measurement
5. Aging, Space Charge, and Maintenance
6. Advanced Materials and Insulation Systems
7. High Voltage Systems and Smart Technologies
8. HVDC Technologies and Applications
9. Industrial Applications of High Voltage

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重要日期
  • 会议日期

    09月06日

    2020

    09月10日

    2020

  • 03月31日 2020

    摘要截稿日期

  • 06月30日 2020

    初稿截稿日期

  • 07月15日 2020

    初稿录用通知日期

  • 08月10日 2020

    终稿截稿日期

  • 08月10日 2020

    提前注册日期

主办单位
IEEE 清华大学 IEEE电介质和电气绝缘协会
承办单位
清华大学
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