Graded surface roughness of epoxy: A novel approach of surface modification to enhance surface flashover Voltage
编号:578 访问权限:仅限参会人 更新:2022-09-18 16:28:15 浏览:120次 张贴报告

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摘要
The optimized surface condition of the polymer dielectrics in HVDC applications can dramatically alter their flashover characteristics. The proposed work in this paper aims to elevate the DC flashover voltages of epoxy after being physically polished with sandpaper of different gradings. The non-polished and homogenously polished specimens with roughness Ra = 0.54, 3.16, 5.24 and 8.35 µm are obtained. Moreover, the epoxy with graded surface roughness is fabricated and the flashover test of all the samples is conducted in vacuum. The DC flashover voltages of the homogenously polished samples for either positive or negative polarity are obviously improved compared to the pristine epoxy and increase by increasing the surface roughness. The specimen with graded surface roughness in the perpendicular direction to the electrodes shows the highest improvement in the flashover characteristics. Surface conductivity, surface potential and surface trap characteristics are further studied to investigate the mechanism of the proposed concept. It can be inferred from the results and theoretical explanation that the proposed surface conditioning method can help to improve the insulation strength of the future dielectrics for HVDC applications.
关键词
Surface Flashover;;functiaonally graded material;surface traps;epoxy
报告人
Inzamam Ul Haq
P.h.D student Chongqing University

稿件作者
Inzamam Ul Haq Chongqing University
Feipeng Wang Chongqing University
Shakeel Akram Sichuan University
Muhammad Fasehullah China; Chongqing University; School of Electrical Engineering; Chongqing 400044;State Key Lab of Power Transmission Equipment & System Security and New Technology
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重要日期
  • 会议日期

    09月25日

    2022

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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