Mechanism study and performance analysis of self-healing room temperature silicone rubber
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摘要
Polymer matrix composites are susceptible to multi-field compounding during processing and service, resulting in micro-damage that is difficult to discern with eyes, causing a reduction in the mechanical strength and dielectric properties of polymer composites.Therefore it is essential to prepare polymer-based composites with self-healing properties. To address the above problems, the room temperature vulcanised silicone rubber with the self-healing function is prepared using disulphide-bonded silanes as Room temperature vulcanised silicone rubber (RTV) crosslinkers. The self-healing principle of the coating was analyzed.The Fourier Transform infrared spectroscopy(FTIR), self-healing performance and Thermal Gravimetric Analyzer (TGA) of the self-healing coating containing 7.5 wt% disulphide-bonded silanes crosslinking agent were also tested. The results show that the coatings have self-healing properties and heat resistance.The FTIR indicates the presence of S-S bond in the silicone rubber. At 7.5 wt% disulphide-bonded silanes crosslinker, the coating can repair wounds with a depth of 1, 4, 7mm and the coating has a thermal decomposition temperature of 180 oC.
关键词
RTV, self-healing, S-S bond, heat resistance
报告人
Lei Peng
Guangdong Key Laboratory of Electric Power Equipment Reliability, Electric Power Research Institute of Guangdong Power Grid Co., Ltd.

稿件作者
Lei Peng Guangdong Key Laboratory of Electric Power Equipment Reliability, Electric Power Research Institute of Guangdong Power Grid Co., Ltd.
Fanyun Su Chongqing University
Junping Lin Chongqing University
Yingfan Zhang Chongqing University
Zhengyong Huang Chongqing University
Zhi Li Guangdong Key Laboratory of Electric Power Equipment Reliability, Electric Power Research Institute of Guangdong Power Grid Co., Ltd.
Qiang Fu Guangdong Key Laboratory of Electric Power Equipment Reliability, Electric Power Research Institute of Guangdong Power Grid Co., Ltd.
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重要日期
  • 会议日期

    09月25日

    2022

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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