报告详情
Self-Healing of Electrical/Mechanical Damage in Smart Copolyimide
编号：101
访问权限：公开
更新：2022-09-12 09:15:48
浏览：68次
张贴报告
摘要
Polyimide (PI) dielectric films have been widely used in electronic equipment and power systems due to their chemical stability, high temperature resistance and excellent insulation strength. Meanwhile, electrical/mechanical damage is one of the main factors threatening reliability and service life, which could be solved with self-healing polyimides. However, the ultra-high stability of polyimide brings great difficulties to self-healing. In this work, a copolyimide (CPI) film copolymerized with polyurea (PUA) are designed to adapt to self-healing after electrical and mechanical damage. The key of this technology is that the PI unit can ensure the thermal stability and insulation strength of CPI, and the hydrogen bond in PUA can promote the self-healing of CPI after damage. Clearly, the CPI film prepared by simple copolymerization process has high mechanical properties and insulation strength, and also has good self-healing ability after mechanical and electrical damage. Furthermore, this method of preparing high strength, high insulation and self-healing CPI provides ideas for the development of smart PI, which will promote the application of intelligent PIs in the field of electrical and electronic engineering.
关键词
copolyimide, self-healing, electrical/mechanical damage
报告人
Baoquan Wan
University of Science and Technology Beijing稿件作者
全部评论
重要日期
-
会议日期
09月25日
2022
至09月29日
2022
-
08月15日 2022
提前注册日期
-
09月10日 2022
报告提交截止日期
-
11月10日 2022
注册截止日期
-
11月30日 2022
初稿截稿日期
-
11月30日 2022
终稿截稿日期
主办单位
IEEE DEIS
承办单位
Chongqing University
联系方式
- Zhengyong Huang
- 61******@qq.com
历届会议
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2020年09月06日 中国 Beijing
2020 IEEE International Conference on High Voltage Engineering and Application -
2018年09月10日 希腊
2018 IEEE International Conference on High Voltage Engineering and Application -
2016年09月19日 中国 Chengdu, China
2016 IEEE International Conference on High Voltage Engineering and Application
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