902 / 2022-08-05 18:30:51
Mechanism study and performance analysis of self-healing room temperature silicone rubber
RTV, self-healing, S-S bond, heat resistance
终稿
Lei Peng / Guangdong Key Laboratory of Electric Power Equipment Reliability, Electric Power Research Institute of Guangdong Power Grid Co., Ltd.
Fanyun Su / Chongqing University
Junping Lin / Chongqing University
Yingfan Zhang / Chongqing University
Zhengyong Huang / Chongqing University
Zhi Li / Guangdong Key Laboratory of Electric Power Equipment Reliability, Electric Power Research Institute of Guangdong Power Grid Co., Ltd.
Qiang Fu / Guangdong Key Laboratory of Electric Power Equipment Reliability, Electric Power Research Institute of Guangdong Power Grid Co., Ltd.
Polymer matrix composites are susceptible to multi-field compounding during processing and service, resulting in micro-damage that is difficult to discern with eyes, causing a reduction in the mechanical strength and dielectric properties of polymer composites.Therefore it is essential to prepare polymer-based composites with self-healing properties. To address the above problems, the room temperature vulcanised silicone rubber with the self-healing function is prepared using disulphide-bonded silanes as Room temperature vulcanised silicone rubber (RTV) crosslinkers. The self-healing principle of the coating was analyzed.The Fourier Transform infrared spectroscopy(FTIR), self-healing performance and Thermal Gravimetric Analyzer (TGA) of the self-healing coating containing 7.5 wt% disulphide-bonded silanes crosslinking agent were also tested. The results show that the coatings have self-healing properties and heat resistance.The FTIR indicates the presence of S-S bond in the silicone rubber. At 7.5 wt% disulphide-bonded silanes crosslinker, the coating can repair wounds with a depth of 1, 4, 7mm and the coating has a thermal decomposition temperature of 180 oC.

 
重要日期
  • 会议日期

    09月25日

    2022

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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