660 / 2022-03-31 10:31:20
Aging characterization of P(VDF-HFP)-based nanocomposites filled with Co3O4 2D nanomaterials
dielectric film,Aging characterization,polymer-based nanocomposites,insultation performance
摘要录用
Fan Xu / School of Electrical Engineering; Chongqing University
Yu Wang / Chongqing University
Feipeng Wang / Chongqing University
As one of the most promising candidates for next-generation high-performance insulating materials, nanocomposite dielectrics tend to have higher resistivity and breakdown field strength than substrates. In the past few decades, there are reports achieve good performance through the doping of various types and morphologies of nanomaterials, but there are few studies on aging characteristics, especially the systematic study of different dimensions of the same material. Therefore, we design and synthesize zero-dimensional (0D), 1D and 2D Co3O4 nanomaterials, using P(VDF-HFP) with high dielectric constant as the substrate, to analysis the characterization and electrical properties of nanocomposites before and after aging. The color of the film turns yellow after aging treatment, which is due to the formation of a part of conjugated double bond (C=C-C=C) structure on the molecular chain due to the bimolecular elimination reaction in PVDF-HFP. Because of the big π bond generated by its conjugation effect, the distance among the energy levels is shortened, and the electrons are easily excited. Therefore, the electrical properties of the aged samples significantly decreased. However, the big π bond makes deeper electron transfer between the macromolecule and 2D Co3O4 nanomaterials for low-concentration nanocomposites, which makes the role of trapping-detrapping space charge of interface is heightened. So, the reduction of insulation performance of aged Co3O4/ PVDF-HFP is effectively suppressed. This work not only provides an effective strategy for unravelling the aging mechanism of nanocomposites, but also actively explores the practical application of nanocomposites.

 
重要日期
  • 会议日期

    09月25日

    2022

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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