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651 / 2022-03-31 09:07:03
Study on Debonding Defect Detection of Room Temperature Vulcanized Silicone Rubber Coatings Based on Ultrasonic C - scan Detection
RTV,coating debonding,ultrasonic c-scan,image segmentation
5. High Voltage Insulation System: Liquid, Solid Dielectrics
摘要录用
xuanxiang zhao / Xi'an Polytechnic University
  The application of RTV silicone rubber anti-pollution flashover coating is an important means to improve the external insulation level of equipment. Due to irregular construction operations or long-term aging, the coating will debond, which will seriously affect the external insulation level of the equipment and threaten the safe operation of the power system. Therefore, it is urgent to carry out research on ultrasonic nondestructive testing of internal debonding defects of RTV coatings. In this paper, the ultrasonic C-scan detection system of RTV coating defects was built to test the prepared RTV coating debonding defect samples. The scanning data are reconstructed by three-dimensional projection, and the size of the debonding defect is quantitatively analyzed based on image segmentation algorithm. Finally, the accurate location and size of the defect are obtained. The test results show that the ultrasonic C-scan detection system for RTV coating debonding defects built in this paper can accurately detect the size of RTV coating debonding defects and the part where weak bonding is about to fall off. Through the establishment of three-dimensional and two-dimensional scanning maps of defect data, intuitive detection results can be obtained, which is obvious for RTV coating bonding defect detection. This study has important engineering value for carrying out debonding defect detection of antifouling flashover coatings and solving the problem of unclear standards for evaluating coating defects during equipment maintenance.
重要日期

  • 会议日期

    09月25日

    2022

    至

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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