5 / 2022-02-17 16:42:30
Study on Microcapsules for Self-healing System of Silicone Rubber Insulating Material
microcapsule,self-healing,insulating material,silicone rubber
摘要录用
Mingzhe Li / Shenzhen International Graduate School (SIGS), Tsinghua University
Ruiqi Shang / Shenzhen International Graduate School (SIGS), Tsinghua University
Bin Cao / Shenzhen International Graduate School (SIGS), Tsinghua University
Liming Wang / Shenzhen International Graduate School (SIGS), Tsinghua University
Silicone rubber is one of the commonly used insulating materials in the field of outdoor insulation. In adverse conditions (such as ultraviolet, corona discharge, and thermal oxygen), silicone rubber materials are very susceptible to aging and its service life is not long enough. Cracking and microcracks are common phenomena in the aging process of silicone rubber insulating materials. Microcapsule self-healing technology is commonly used for extrinsic self-healing polymer materials, and provides the possibility to repair microcracks of silicone rubber and prolong the service life of silicone rubber. In this paper, microcapsules that poly (urea-formaldehyde) (PUF) as shell and methyl hydrogen siloxane (hydrogen silicone oil) as core was successfully prepared by in-situ polymerization. The effect of emulsifiers on the preparation process of microcapsules was studied. The basic properties of microcapsules were tested by scanning electron microscopy (SEM), infrared spectroscopy and thermogravimetric analysis (TG). The results show that the combination of poly (ethylene-alt-maleic anhydride) (EMA) / polyvinyl alcohol (PVA) was most suitable for the preparation of PUF microcapsules. The coating of hydrogen silicone oil repairing agent by PUF was successfully realized. Microcapsules have excellent thermal stability and have the potential as a material for self-healing system of silicone rubber insulating material.
重要日期
  • 会议日期

    09月25日

    2022

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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