395 / 2022-03-15 19:47:51
Effect of different curing agents on electrical aging properties of cured epoxy resin
Epoxy resin,Curing agent,Breakdown electric,Electrical aging
摘要录用
基宏 黄 / 本人
杜 斌 / 合肥工业大学
Purpose/Aim

The curing materials of epoxy resin prepared by different types of curing agent are significantly different. In order to study the effect of different curing agents on the electrical resistance of cured epoxy resin, 3-cured epoxy resin was prepared by the reaction of DER331 epoxy resin with MTHPA, MHHPA and MNA, and the electrical properties of these three cured epoxy resin were tested. The results show that EP/MTHPA has the best performance.

Experimental/Modeling methods

The preparation ratio of the three cured substances is shown in Table 1The curing agent and epoxy resin were placed in a drying oven at 130 ℃ for 2 h. Heat the mixture dispersively to 120 ℃ and vacuum. The mixture was cured for 5 h before vacuum drying at 100 ℃. After demoulding, the sample was placed in a drying oven at 130 ℃ for curing for 20 h. According to GB1411-78 and GB/T 1408.1-2016, test the arc resistance and breakdown voltage of the sample.

Results/discussion

The development of electrical branches in insulating materials showed a trend of rapid development at first, then slowed down the development of surrounding and accelerated development, and finally the development of electrical branches in EP/MTHPA anhydride cured materials was significantly smaller than other cured materials.

Conclusions

The breakdown field strength and arc resistance strength from large to small are EP/MTHPA, EP/MHHPA, EP/MNA; The difference of curing agent functional groups is one of the reasons for the huge difference of EP / curing agent; Steric hindrance is one of the reasons affecting the physical properties of EP curing.

Appendix (Figure, table, image…)

Table 1 Preparation ratio of epoxy resin composites
































Sample Epoxy resin Curing agent Promoter Curing process
DER331+MNA 100 90.9 0.5 80℃/4h+140℃/12h
DER331+MTHPA 100 84.8 0.5 80℃/4h+140℃/12h
DER331+MHHPA 100 85.8 0.5 100℃/4h+150℃/12h



 
重要日期
  • 会议日期

    09月25日

    2022

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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