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25 / 2022-03-01 17:46:04
Study on Process and Interface Microstructure of Integrated Circuit Solder Joints by Electromagnetic Pulse Welding
Solder joints,Electromagnetic pulse welding,Integrated circuits,IMC,Microstructure
13. Aging, Space Charge, and Industrial Applications
摘要录用
Chengxiang Li / 重庆大学电气工程学院
Ting Shen / State Key Laboratory of Power Transmission Equipment & System Security and New Technology
Yan Zhou / State Key Laboratory of Power Transmission Equipment & System Security and New Technology
Chennan Xu / State Key Laboratory of Power Transmission Equipment & System Security and New Technology
Ming Dai / State Key Laboratory of Power Transmission Equipment & System Security and New Technology
Dan Chen / College of Materials Science and Engineering, Chongqing University
Solder joints are the main interconnect structure of integrated circuits, and the electrical-thermal-mechanical coupling can lead to the growth of intermetallic compounds (IMCs) and voids, which reduces the reliability and service life of solder joints. This work proposes a process of electromagnetic pulse welding (EMPW) of integrated circuit solder joints. Electromagnetic force is used to drive the pads to collide directly to form metallurgical bonds to avoid the generation of IMC and voids. To verify the feasibility of the method, an EMPW platform was built for welding the Cu foils and the experiments were carried out. Then, the microstructure and element distribution of the bonding interface were analyzed by SEM and EDS, respectively. When the discharge energy is increased from 7 kJ to 14 kJ, the Cu foil can be welded from unweldable to welding, and the bonging area gradually increases. The SEM analysis results show that there is no IMC and no obvious corrugated interface between the Cu foils, and the bonding area forms a whole; the EDS analysis results further verify that the elemental composition between the Cu foils is only copper. The process can reduce the probability of failure due to electromigration, thermal migration, thermal stress and other problems during the working process of the solder joints, and provides theoretical basis and experimental support for improving the service reliability of integrated circuit solder joints.
重要日期

  • 会议日期

    09月25日

    2022

    至

    09月29日

    2022

  • 08月15日 2022

    提前注册日期

  • 09月10日 2022

    报告提交截止日期

  • 11月10日 2022

    注册截止日期

  • 11月30日 2022

    初稿截稿日期

  • 11月30日 2022

    终稿截稿日期

主办单位
IEEE DEIS
承办单位
Chongqing University
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