摘要详情
239 / 2022-03-14 21:19:59
Process Effects of Environmental Factors on The Evolution of Epoxy Resin Microstructures
composite insulator; epoxy resin; molecular dynamics; electric field strength; temperature
终稿
Because molecular simulation techniques can demonstrate the relationship between macroscopic properties of polymers and microscopic changes, the technique is important for the design of high-performance epoxy composite insulators.This paper uses molecular dynamics simulation methods and Materials Studio molecular simulation software to simulate the curing cross-linking reaction between epoxy resin and methyltetrahydrophthalic anhydride, and constructs a reasonable epoxy resin cross-linking system through structural optimisation. The discharge and high temperature caused by high field strength can lead to the ageing of the composite insulator material, so this experiment investigates the effect of both on the epoxy resin polymerisation material by varying the electric field strength and temperature.The results show that changes in electric field strength and temperature affect the bond lengths and bond angles of epoxy resin polymer materials, which in turn lead to changes in the macroscopic properties of the polymer materials.The results reveal the correlation between changes within polymer molecules and changes in macroscopic properties of polymer materials at a microscopic level, providing a reference for the development of high-performance composite insulators.
重要日期
-
会议日期
09月25日
2022
至09月29日
2022
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08月15日 2022
提前注册日期
-
09月10日 2022
报告提交截止日期
-
11月10日 2022
注册截止日期
-
11月30日 2022
初稿截稿日期
-
11月30日 2022
终稿截稿日期
主办单位
IEEE DEIS
承办单位
Chongqing University
联系方式
- Zhengyong Huang
- 61******@qq.com
历届会议
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2020年09月06日 中国 Beijing
2020 IEEE International Conference on High Voltage Engineering and Application -
2018年09月10日 希腊
2018 IEEE International Conference on High Voltage Engineering and Application -
2016年09月19日 中国 Chengdu, China
2016 IEEE International Conference on High Voltage Engineering and Application
