In recent years, material printing on flexible and disposable substrates has received substantial interest for realizing low cost, large-area electronics and sensing systems. As a result, new methods such as printing and additive manufacturing, etc. have also received significant attention to develop a wide range of easily deployable systems such as displays, sensors and RFID tags. The technologies developed for silicon based planar electronics and solid-state sensors is also being re-purposed to meet the demands in the emerging field of flexible and printed sensors.
This trend will continue as all market indicators point towards significant growth in this area. Given the exponential growth seen in the flexible, printed and disposable sensor technology, the development of novel printable and solution processable nanomaterials, and the development of novel printing techniques that have brought about a new wave of novel printed sensor technologies and applications, the IEEE FLEPS offers an excellent forum to discuss latest developments in the field as well as understand the future roadmap.
Sponsor Type:1
Thilo Sauter
General Co-Chair
TU Wien and Danube University Krems
Luigi Occhipinti
General Co-Chair
University of Cambridge, UK
Luisa Torsi
Technical Program Co-Chair
University of Bari, Italy
Ravinder Dahiya
Technical Program Co-Chair
University of Glasgow, Scotland, UK
Organic/Inorganic Electronic Sensors
Emerging Materials for Flexible and Printable Systems
Manufacturing Techniques
High-throughput Printable Electronics
Hybrid Flexible Sensors and Electronics
Stretchable/Shrinkable Sensors and Electronics
Soft/Smart Wearable and Implantable Sensing Systems
Disposable/Reusable Sensors and Electronics
Printed Large-Area Sensors and Systems
Flexible or Printed Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
Simulation and Modelling
Flexible/Printable Electronics in context with Circular Economy and green electronics
07月10日
2022
07月13日
2022
初稿截稿日期
初稿录用通知日期
注册截止日期
2023年07月09日 美国 Boston
2023 IEEE International Conference on Flexible and Printable Sensors and Systems2021年06月20日 英国 Manchester
2021 IEEE International Conference on Flexible and Printable Sensors and Systems
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