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活动简介

Following the success of previous IEEE ICCS, 2021 IEEE 3rd International Conference on Circuits and Systems will take place in Chengdu, China, during Oct. 29-31, 2021. ICCS 2021 is sponsored by IEEE, hosted by University of Electronic Science and Technology of China.

ICCS is an international networking platform for researchers in the highly active fields of theory, design and implementation of circuits and systems, to listen, learn and discuss about the most recent scientific and industrial developments and advancements in the area, to identify new issues, and to shape future directions for research. It is a perfect opportunity for PhD candidates to show the progress of their scientific work in front of the conference either as lecture or poster presentations. The congress has the focus on the frontier topics in the theoretical and applied engineering.

Sponsor Type:5

组委会
ADVISORY CHAIR

Vladimir Terzija, Shandong University, China (IEEE Fellow)

CONFERENCE CHAIRS

Letian Huang, University of Electronic Science and Technology of China
Esteban Tlelo-Cuautle, National Institute of Astrophysics, Optics and Electronics, INAOE

PROGRAM CHAIRS

Hideharu Amano, Keio University
Xiaohang Wang, South China University of Technology
Wang Kang, Beihang University
Jayakumari. J, Mar Baselios College of Engineering and Technology

LOCAL ORGANIZING CHAIR

Qun Zhou, Sichuan University

LOCAL ORGANIZING COMMITTEE

Wei Jiang, University of Electronic Science and Technology of China
Hai Wang, University of Electronic Science and Technology of China
Qihong Huang, Chengdu University of Information Technology

PUBLICATION CHAIR

Zhang Tian, Sichuan University

PUBLICITY CHAIRS

Meng Zhang, Southeast University
Tae Hyoung Kim, Nanyang Technological University

TUTORIAL CHAIR

Yong Chen, University of Macau

TUTORIAL CO-CHAIR

Bo Zhao, Zhejiang University

TREASURE

Huanhuan Liu, Sichuan University
TECHNICAL COMMITTEE

Anthony Kong, Hong Kong Design Institute
Ce Zhou Zhao, Xi’an Jiaotong-Liverpool University
Chi-Seng Lam, University of Macau
Chong Li, University of Glasgow, UK
D. G. Liu, Feng Chia University
Daniel Mueller-Gritschneder, Technische Universitaet Muenchen
David Hicks, Texas A&M University
Francesco Ponzio, Polytechnic University of Turin
Haibing Wang, Hohai University
Hailong Jiao, Peking University Shenzhen Graduate School
Haiying Yuan, Beijing University of Technology
Hao Gao, Eindhoven University of Technology
Haruo Kobayashi, Gunma University
M. C. Wang, Minghsin University of Science and Technology
Mo Huang, University of Macau
Paul Zhou, Analog Devices
Shagun Bajoria, Eindhoven university of Technology
Sijun Du, Delft University of Technology
Smitha K. G., Nanyang Technological University
Wei Liu, Chongqing University of Technology
Wen-Shiung Lour, National Cheng Kung University
Xiangyu Meng, SUN YAT-SEN University
Xiaohang Wang, South China University of Technology
Xiaozong Huang, CETC
Yongbing Hu, Anhui University
Zhiguo Yu, Jiangnan University
征稿信息

All submissions must describe original research, not published or currently under review for another workshop, conference, or journal. All accepted papers will be published by conference proceedings.

征稿范围

We invite submissions of high-quality papers describing fully developed results or ongoing work on the following topics and related areas, but are not limited to:

 Analog signal processing
 Analog circuits and filters
 Switched capacitor and switched current techniques
 Analog and mixed signal processing
 Data conversion and sigma-delta modulation
 Low-power and low-voltage circuits
 Radio frequency circuits
 Log-domain circuits
 Visual signal processing and communications
 Linear and nonlinear circuits and systems
 Chaos and applications
 Distributed circuits and systems
 Power electronics and systems
 Biomedical circuits and systems

 Analog and digital ICs
 Low power design
 VLSI physical design
 Testing: analog, digital and mixed
 High level synthesis and hardware/software co-design
 Modelling, simulation and CAD tools
 Microsystems and applications
 Processor architectures
 Deep sub/micron design
 Information theory
 Coding and modulation
 Turbo codes and iterative decoding
 Equalization, synchronization and channel estimation
 Space-Time coding and processing
 Multiple access techniques

作者指南

Full Paper

The manuscript in double-column format, up to 10 pages. Manuscripts must be written in English and follow the instructions at Manuscript Formatting and Templates.
To ensure the high quality of the accepted papers, all submissions will be peer-reviewed. Please only submit original material where copyright of all parts is owned by the authors declared and which is not currently under review elsewhere.
Registered and presented papers will be included in conference proceedings.

Abstracts

For those papers do not want to be published but presenting and discussing at the conference, you can submit an abstract first, for presentation only. Your abstract will not be published but only included in the conference program book.

Submission Instructions
  • Full Paper Template;
  • Abstract Template;

For any questions, please send email to Dr. Tina T. Wang via iccs@chairmen.org.

Poster/Oral Presentation

Accepted articles will be invited for as oral or poster presentation, depending on the nature and quality of the paper.

Important Dates
  • Submission Deadline: Before 30 May, 2021
  • Notification: 30 June, 2021
  • Registration Deadline: 20 July, 2021
  • Conference dates: 29-31 October, 2021
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重要日期

  • 会议日期

    10月29日

    2021

    至

    10月31日

    2021

  • 10月31日 2021

    注册截止日期

主办单位
Chengdu Section CEDA Chapter
承办单位
University of Electronic Science and Technology of China
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