An Automated Electro-Thermal-Mechanical Co-Simulation Methodology Based on PSpice-MATLAB-COMSOL for SiC Power Module Design
编号:73 访问权限:仅限参会人 更新:2021-07-21 20:05:53 浏览:205次 口头报告

报告开始:2021年08月27日 08:45(Asia/Shanghai)

报告时间:15min

所在会场:[Room1] Oral Session 1 [S1&S2] WBG Device Modeling, Simulation and Reliability

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摘要
The lack of the methodology to characterize the electro-thermo-mechanical interaction mechanism in SiC power module has brought great challenges to the multi-physics co-simulation of the power module.  In this article, an automated multi-physical fields modeling and co-simulation methodology based on PSpice-MATLAB-COMSOL is proposed for SiC power module design. Firstly, the multi-physical fields coupling mechanism and basic co-simulation principle of the proposed methodology are described. Then, the co-simulation software interface and indirect coupling strategy are designed for this methodology, which can reflect the evolution of various physical fields of SiC power module from initial condition to steady state through continuous transient simulation. Finally, the proposed co-simulation methodology is verified by direct steady-state thermal simulation of a self-designed SiC MOSFET power module. A SiC MOSFET power module based Buck converter is also under development to further validate the accuracy of the the proposed simulation methodology.
关键词
Electro-Thermal-Mechanical,SiC Power Module,Co-Simulation
报告人
Yayong Yang
student Huazhong University of Science and Technology

稿件作者
Yayong Yang Huazhong University of Science and Technology
Zhiqiang Wang 华中科技大学
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重要日期
  • 会议日期

    08月25日

    2021

    08月27日

    2021

  • 04月21日 2021

    摘要截稿日期

  • 05月15日 2021

    摘要录用通知日期

  • 06月25日 2021

    终稿截稿日期

  • 08月24日 2021

    报告提交截止日期

  • 08月27日 2021

    注册截止日期

主办单位
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
承办单位
Huazhong University of Science and Technology
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