Analysis of Dynamic Current Balancing in Multichip SiC Power Modules Based on Coupled Parasitic Network Model
编号:71 访问权限:仅限参会人 更新:2021-08-05 19:16:33 浏览:276次 口头报告

报告开始:2021年08月27日 16:30(Asia/Shanghai)

报告时间:15min

所在会场:[Room1] Oral Session 1 [S3&S4] WBG Device Applications, Package Design & Analysis

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摘要
The parasitic effect induced by the interconnections in packaging brings about the dynamic current mismatch among paralleled dies, thus limiting the available capacity of the power module. In this paper, general analysis based on coupled parasitic network model is carried out to reveal the mechanism of layout-dominated dynamic current balancing in multichip silicon carbide (SiC) power modules. At first, according to the physical significance of parasitic parameters in power module, the coupled parasitic network model at switching transients is established to analyse the mechanism of dynamic current balancing. Next, for two different module layouts, parasitic parameters taking magnetic coupling into account are extracted from Q3D, including partial inductances and equivalent series resistances. Besides, on the basis of state space frequency-dependent model derived from the acquired parasitic parameters, the coupling simulation is conducted in SIMPLORER. Finally, the simulation data and switching waveforms of SiC MOSFETs are combined to verify the effectiveness of the proposed dynamic current balancing equations. As optimization guidelines, those can be satisfied by adjusting module layout to modify self and mutual partial inductances of the paralleled dies.
关键词
Dynamic current sharing,multichip power modules,package layout,SiC MOSFET,coupled parasitic network model
报告人
Yuxin Ge
Huazhong University of Science and Technology

稿件作者
Yuxin Ge Huazhong University of Science and Technology
智强 王 华中科技大学
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重要日期
  • 会议日期

    08月25日

    2021

    08月27日

    2021

  • 04月21日 2021

    摘要截稿日期

  • 05月15日 2021

    摘要录用通知日期

  • 06月25日 2021

    终稿截稿日期

  • 08月24日 2021

    报告提交截止日期

  • 08月27日 2021

    注册截止日期

主办单位
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
承办单位
Huazhong University of Science and Technology
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