Electrical Insulation Packaging for High Voltage High Power IGBT Modules using Nonlinear Conductivity Composites
编号:24 访问权限:公开 更新:2021-07-21 20:02:05 浏览:229次 张贴报告

报告开始:2021年08月27日 12:43(Asia/Shanghai)

报告时间:1min

所在会场:[P] Poster [P1] Poster 1

摘要
Wide band gap (WBG) semiconductor devices are developing rapidly due to their superior performance compared to traditional silicon-based devices. However, the packaging technology of traditional devices has limited the application of WBG semiconductor devices because of the challenges in the electrical insulation. The complex environment of high blocking voltage, high frequency and high temperature is the major reason for the insulation failure of encapsulation structure. Therefore, in this paper, an epoxy resin composite with nonlinear conductivity is proposed to be used as a coating to improve the electric field distribution of high voltage high power IGBT modules. Firstly, an electrical field simulation model was built considering the thermal stress. It was found that the electric field in high temperature was improved compared with that in room temperature due to the temperature-dependent conductivity of silicone gel. Nevertheless, the risk of insulation failure still exists. After the application of nonlinear conductivity materials (NCMs) coating, the maximum electric field at the triple junctions and the ratio of electric field distortion in high field areas were significantly decreased. Further analysis showed that the optimization degree of electric field increased with the increase of the blocking voltages or power losses in IGBT chip. The results have demonstrated that the NCMs can reduce the maximum electric field in the IGBT encapsulation structure by 73 % under the operating conditions of 120 W 10 kV. Partial discharge (PD) tests shows that the PDIV of the substrates with NCM coating is increased by 33% compared with the normal encapsulation structure and the coating significantly inhibits the growth of electric trees. The presented results indicate that the NCMs have the potential to improve the insulation performance of high voltage high power IGBT modules.
关键词
packaging,Temperature,Composite
报告人
Kaixuan Li
Doctoral Candidate XJTU

稿件作者
Kaixuan Li XJTU
Boya Zhang XJTU
Xingwen Li XJTU
Haotao Ke CRRC
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重要日期
  • 会议日期

    08月25日

    2021

    08月27日

    2021

  • 04月21日 2021

    摘要截稿日期

  • 05月15日 2021

    摘要录用通知日期

  • 06月25日 2021

    终稿截稿日期

  • 08月24日 2021

    报告提交截止日期

  • 08月27日 2021

    注册截止日期

主办单位
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
承办单位
Huazhong University of Science and Technology
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