Analysis of the influence of vibration and thermal vibration coupling on the power module
编号:116 访问权限:仅限参会人 更新:2021-07-21 20:06:20 浏览:232次 口头报告

报告开始:2021年08月27日 10:00(Asia/Shanghai)

报告时间:15min

所在会场:[Room1] Oral Session 1 [S1&S2] WBG Device Modeling, Simulation and Reliability

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摘要
This paper uses finite element simulation to study the influence of the area, thickness and material of the substrate on the solder layer of the power module under a random vibration environment. The results show that as the area of the substrate increases, the thickness decreases, and the density increases, the solder layer stress increases and it is more prone to failure. In addition, the influence of random vibration on the power module is studied under the premise of thermal load. It is found that the thermal load will make the influence of random vibration on the solder layer smaller.
 
关键词
Vibration,Thermal Vibration Coupling,Power Module
报告人
JiaJia Guan
Huazhong University of Science and Technology

稿件作者
JiaJia Guan Huazhong University of Science and Technology
Cai Chen Huazhong University of Science and Technology;State Key Laboratory of Advanced Electromagnetic Engineering and Technology
Yong Kang Huazhong University of Science and Technology;School of Electrical and Electronic Engineering
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重要日期
  • 会议日期

    08月25日

    2021

    08月27日

    2021

  • 04月21日 2021

    摘要截稿日期

  • 05月15日 2021

    摘要录用通知日期

  • 06月25日 2021

    终稿截稿日期

  • 08月24日 2021

    报告提交截止日期

  • 08月27日 2021

    注册截止日期

主办单位
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
承办单位
Huazhong University of Science and Technology
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