301 / 2017-12-08 02:03:55
Online Junction Temperature Estimation using Integrated Temperature Sensor for SiC Modules
终稿
Ping Liu / Hunan University
Xing Zhang / Hunan University
Huai Wang / Aalborg University
Haoze Luo / Aalborg University
Frede Blaabjerg / Aalborg University
Silicon Carbide (SiC) power MOSFETs have the potential to be adopted in high reliability applications such as the automotive and aerospace. The measurement or estimation of its junction temperature is an emerging technology for high performance control, condition monitoring, and lifetime estimation. This paper deals with real-time estimation of the junction temperature using integrated negative thermal coefficient (NTC) thermistor in SiC modules. A simplified thermal model is built to accurately describe the transient impedance between the chip and the integrated NTC, of which parameters can be derived from Finite Element Methods (FEM) simulation. Then the junction temperature of the module is online estimated based on the obtained thermal model and NTC sensor measurement. The effectiveness of the proposed method is verified by experimental results. This concept can be applied to power electronics converters.
重要日期
  • 会议日期

    05月17日

    2018

    05月19日

    2018

  • 12月08日 2017

    摘要截稿日期

  • 01月30日 2018

    摘要录用通知日期

  • 02月10日 2018

    初稿截稿日期

  • 02月10日 2018

    终稿截稿日期

  • 05月19日 2018

    注册截止日期

主办单位
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
IEEE POWER ELECTRONIC SOCIETY
中国电源学会
中国半导体产业创新联盟
承办单位
西安交通大学
西安电子科技大学
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