Symposium VII: Packaging and Assembly

• 3DIC/WLSCP/TSV process and reliability

• FC/MCP/die stacking/package stacking

• Embedded active/passive integration

• MEMS and sensor packaging technology

• RF and microwave packaging technology

• LED and photovoltaic packaging technology

• Emerging technology/Nanotechnology

• Future packaging materials

• Interconnect

• Thermal mechanical/electrical/thermal modeling

• HDI/high performance interposer design and manufacturing

• Thermal management/active cooling

• Supply chain management