The 2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2017) will be held in Honolulu, Hawaii, 4-6 June 2017.
The conference starts on Sunday, 4 June 2017 with workshops and short courses, followed by two Plenary talks and Reception embedded with joint Industry Showcase and Interactive Forum. Monday, 5 June and Tuesday, 6 June 2017 will be comprised of presentations of contributed papers and special lunch-time panel sessions.
The conference will solicit papers describing original work in RFIC circuits, system engineering,design methodology, RF modeling and CAD simulation, RFIC technologies, devices, fabrication, testing, reliability,packaging and modules to support RF applications in areas such as, but not limited to:
Wireless Cellular & Connectivity ICs: LTE/LTE-Advanced, 5G Massive MIMO, LTE-M, WWAN, WLAN,802.11ax, Bluetooth, GPS
Low Power Transceivers: IoT, RFID, NFC, Zigbee, WPAN, WBAN, Biomedical, Sensor Nodes
RF Front-End ICs: LNAs, Mixers, Demodulators, VGAs, Filters, Phase shifters, switches, Full-duplex applications, and Interference cancellation
Mixed-Signal RF and Analog Baseband Circuits: ADCs, DACs, Sub-sampling/Over- sampling Circuits, and analog baseband circuitry including filters and modulators
Reconfigurable and Tunable Front-Ends: Cognitive Radio, Multi-mode advanced cellular radios, Digitallyassisted RF, and Re-configurable blocks (N-path filter, ADCs, tuners)
Large-Signal Circuits: Power Amplifiers (RF & mm-Wave), Driver amplifiers, Advanced TX circuits,modulators, efficiency enhancement, and Linearization
VCOs and Frequency Multipliers: RF and mm-Wave VCOs, Frequency Multipliers
Frequency Generation Circuits: PLLs, Synthesizers, ADPLL, DDS, Frequency Dividers, DLL, and MDLL
Modeling, CAD and Testing: RF Design Methodology, RF Modeling and CAD, EM Simulation, Co-Simulation,Testing and Analysis of Active/Passive Devices, and Built-in-Test
Process, Device and Packaging Technologies: CMOS, SOI, SiGe, GaAs, GaN, MEMS, Integrated Passives,Photonic, Emerging Devices, Reliability, Packaging, and Modules
mm-Wave Circuits & Systems: mmW SOCs and SIPs above 20GHz for data, video, and imaging, mmW frontend circuits, and mmW-based 5G systems
High-Speed Data Transceivers: Wireline, UWB, Optical Transceivers, and CDRs for High-Speed Data links
06月04日
2017
06月06日
2017
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初稿录用通知日期
终稿截稿日期
注册截止日期
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