From mobile device logic chips on coreless substrates, to 3D memory chip stacks in servers; from "jelly bean" QFN power management devices in automotive engine control modules, to MEMS gyroscopes in heads-up displays – the world of semiconductor packaging has never been more diverse or more complex. This ATW will bring together experts to discuss challenges in assembly processes, materials and packaging technologies, and the technology advances that are being made to overcome these challenges.