EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society.
System-level, board-level and on-chip interconnects
High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
Low power mobile and personal applications
Multiconductor transmission lines
Memory and DDR interfaces
Jitter and noise management
Signal and thermal integrity
Power integrity and power distribution networks (PDNs)
Electronic packages and microsystems
3D interconnects, 3D packages, TSVs and MCMs
Nano interconnects and nano structures
RF/microwave packaging structures, RFICs, mixed signal modules and wireless switches
Package-chip co-design
Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools and flows
Macromodeling and model order reduction as it applies to electrical analysis
Advanced and parallel CAD techniques for signal, power and thermal integrity analysis
Measurement and data analysis techniques for system-level and on-chip structures.
10月23日
2016
10月26日
2016
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2024年10月06日 加拿大 Toronto
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)2013年10月27日 美国
2013 IEEE第22届电子封装系统的电气性能会议
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