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活动简介

The detection of infrared radiation has proven to be a viable tool in environmental studies, homeland security, and in medical, automotive, and military applications. This conference will provide a venue for papers ranging from basic device physics to novel applications. Improvements in infrared sensing & imaging relating to improvements in feature size for the read-out integrated circuit (ROIC) fabrication and compositional and doping control for the detector layer, have led to new opportunities for meeting the needs of the terrestrial, air, and space user communities. Unique IR device structures have been shown to evolve from new capabilities in the nanotechnology realm. Recent developments in novel detector materials, including those for strained superlattice and barrier architectures, promise significant technological advances. Room temperature infrared detectors for terrestrial use also benefit from these advancements. Various read-out circuit architectures allow functionality for higher-performance cooled IR focal plane arrays, and also permit increased capabilities. We are also seeking papers that expand the state-of-the-art in novel pixel readout approaches, improved signal processing, and lower cost, including the digital flow of data off the FPA in the form of LVDS, for example. 

 

The conference is a high-level forum bringing together scientists and engineers involved in the research, design, and development of infrared sensors and focal plane arrays. 

征稿信息

征稿范围

Papers are solicited for infrared technology, including the following topics: 

  • Novel detector materials and architectures
  • SWIR, MWIR, LWIR, and VLWIR detectors
  • materials (e.g., InSb, HgCdTe, InAsSb)
  • nanotechnology-based EO/IR detectors
  • nano-/microbolometers
  • HgCdTe (MCT) technology
  • HgCdTe detector growth on alternative substrates
  • III-V strained-layer superlattice detector technology
  • higher-operating temperature infrared detectors
  • high sensitivity at low photon fluxes
  • avalanche photodiodes
  • Focal plane arrays, read-out integrated circuits, and components
  • FPA signal and data processing, both on- and off-chip
  • electronic readout image intensifier devices
  • smart focal planes
  • diffractive optics on the FPA
  • advanced microchannel plates
  • photon-counting
  • image intensification
  • improved photocathodes
  • plasmonics
  • Applications of IR technology
  • terrestrial, air, and space sensors
  • multispectral sensors
  • imaging spectrometer applications
  • imaging polarimeter applications
  • commercial applications
  • space-based sensing applications
  • astronomical applications
  • industrial & structural applications
  • automotive applications
  • medical applications
  • cameras for low light levels
  • unmanned autonomous vehicle cameras
  • Advanced characterization techniques
  • energetic particle radiation effects
  • anomalous noise sources
  • responsivity and frequency response
  • cryogenic and ultra-low noise.
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重要日期
  • 会议日期

    08月28日

    2016

    09月01日

    2016

  • 09月01日 2016

    注册截止日期

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