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活动简介

On behalf of International Conference on Material Science and Engineering (2016 ICMSE) will be held in Guangzhou, China, June 24-26, 2016, we welcome you to the conference. This Conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new idea, with the aim of developing new projects and exploiting new technology in this filed.

In China, Material Science and Engineering scholars have been growing rapidly, so the conference locates at China has a lot mean to us. Moreover, Guangzhou (Canton), a prosperous metropolis full of vigor, is the capital city of Guangdong Province located along the south coastline of China. Being an excellent port on the Pearl River navigable to the South China Sea, and with fast accessibility to Hong Kong and Macau, the city serves as the political, economic, scientific, educational and cultural center in Guangdong area. We welcome you to the conference because it would be an excellent experience while you stay in Guangzhou City.

2016 ICMSE Conference Editing system is developed to provide guidelines that will help maintain an equitable balance of the interests of all participants in ensuring high quality, scholarly conference proceedings content.

2016 ICMSE organizer, we have developed the editing system to stand as an ideal toward which the development of high quality, scholarly conference content should strive. Our intention is that these same recommended practices will contribute toward awareness and understanding of how these issues affect the global information community in the development and dissemination of high quality, scholarly conference content.

2016 ICMSE organizer, we provide a set of guiding principles from which high quality, scholarly conference proceedings content will be measured by the global information community, and in particular commercial and non-commercial conference proceedings publishers.

2016 ICMSE organizer, we will help facilitate full disclosure and transparency for the ultimate benefit of the global information community

We look forward to seeing you at the conference and also your paper to be published by Trans Tech Publis

  • General Chair

  • Dongyan SHI

  • College of Mechanical and Electrical Engineering

  • Harbin Engineering University

  • No. 145 Nantong Street, Harbin 150001, CHINA

征稿信息

重要日期

2016-04-25
终稿截稿日期

征稿范围

1. Advanced Engineering Materials

(1) Advanced Construction Materials

(2) Biomaterials

(3) Building Materials

(4) Ceramic

(5) Chemical Materials

(6) Composites

(7) Computer Aided Design of Materials

(8) Earthquake Resistant Structures, Materials and Design

(9) Energy Materials

(10) Environmental Catalysis and Environmental Friendly Materials

(11) High Performance Elastomers & Polymers

(12) Hydrogen and Fuel Cell Science, Engineering & Technology

(13) Iron and Steel

(14) Material Processing

(15) Materials Testing and Evaluation

(16) Metal alloy Materials

(17) Micro / Nano Materials

(18) Microwave Processing of Materials

(19) New Energy Materials

(20) New Functional Materials

(21) Optical/Electronic/Magnetic Materials

(22) Process Modeling, Analysis and Simulation

(23) Seismic Materials

(24) Smart/Intelligent Materials/Intelligent Systems

(25) Surface Engineering / Coatings Technology

(26) Textile Materials

(27) Thin Films

(28) Welding and Mechanical Connections

 

2. Materials Processing Technology

(29) Absorption Materials

(30) Adsorption and diffusion in Nanoporous Materials

(31) Alloy and Composite Materials

(32) Amorphous and Crystalline Materials

(33) Amorphous magnetic Materials

(34) Amorphous vs Crystalline Polymers

(35) Applications of Biomaterials Materials science

(36) Biomimetic (Assembly)

(37) Catalytic Ceramic

(38) Chemical Synthesis

(39) Chemical Vapor Deposition (CVD) (Deposition)

(40) Colloid and Materials Science

(41) Composite Materials Science and Applications

(42) Conductivity of materials

(43) Corrosion Resistant Materials

(44) Crystal growth

(45) Crystallographic structure

(46) Defects in Crystals

(47) Diamond Mmaterials Technology

(48) Diffusion Bonding of Materials

(49) Dislocations and Mechanical Behaviour of Materials

(50) Dopant

(51) Dynamic Analysis of Processing

(52) Dynamic Mechanical Analysis, Optimization and Control

(53) Elastic Properties

(54) Electrodeposition - the Materials Science of Coatings and Substrates

(55) Electronic Material

(56) Energy Generation

(57) Energy Storage

(58) Laser Processing Technology

(59) Material Design of Computer Aided

(60) Material Physics & Chemistry

(61) Materials Devices and Nanotechnology

(62) Materials for Adhesion Bonding

(63) Materials Forming

(64) Materials Machining

(65) Mechanical Behavior & Fracture

(66) Microwave Processing of Materials

(67) Modeling, Analysis and Simulation of Manufacturing Processes

(68) Molecular beam epitaxy (mbe)

(69) Morphology Material

(70) Nanoindentation Material

(71) Nanostructure

(72) Nitride

(73) Nucleation & growth

(74) Optical Material

(75) Optical properties

(76) Optoelectronic

(77) Organic Material

(78) Oxidation

(79) Piezoelectric

(80) Polymer

(81) Porosity

(82) Precision Manufacturing Technology and Measurements

(83) Radiation effects

(84) Stress/strain relationship

(85) Structural

(86) Surface Chemistry Thermal

(87) Surface Engineering/Coatings

(88) Theory and Application of Friction and Wear

(89) Thermal Engineering Theory and Applications

(90) Thermoelectric

(91) Tooling Testing and Evaluation of Materials

(92) Transmission Electron Microscopy (TEM)

(93) Waste Management

(94) Welding & Joining

(95) X-ray diffraction (xrd)

作者指南

Paper Submission Information

Once the paper is accepted by 2016 ICMSE committee, we are pleased to send the crucial file for publication to authors separately via e-mail. The acceptance letter and other document will be sent 2-3 days after the registration date. TTP ID and PASSWORD will be sent you in 2-3 days through your e-mail which you have submitted your paper to the ICMSE 2016. Scientific Net system allow you to submit a manuscript by one TTP ID so that you may let us know your TTP ID if you have, other than that we might issue your TTP ID and sent you by your e-mail address.

Manuscript Form Instruction

1. The manuscript length should be minimum 4 pages and average 6 pages.

2. The manuscript should be including a figure, table, and reference.

3. There is an additional charge for the paper over 6 pages.

4. All the paper should be written in English Only.

5. All the paper should be in MS Word file and an identical PDF file according to the following instructions;

All the paper has a file name – (Topic Field) Paper Title.doc

Paper submission form has a file name – (Topic Field) Paper Submission Form.xls Please refer to Call for Paper to fill in Topic Field.

Any submission must not have been, or will not be published elsewhere or submitted to another conference before the review notification date of this conference

Incomplete or published manuscript cannot be accepted. Before the Scientific.net Upload Date Due, author is able to revise the paper by June 10, 2016. However, after the manuscript submission, the author will receive a request of revise own papers by e-mail. There will be last opportunity to correct your paper. While submitting the manuscript, be sure to submit a completed Copyright Agreement to TTP/ Scientific.net.

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重要日期
  • 会议日期

    06月24日

    2016

    06月26日

    2016

  • 04月25日 2016

    终稿截稿日期

  • 06月26日 2016

    注册截止日期

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