We solicit your submissions in any topical area including the following:

1. 3D/Heterogeneous Integration
2. Build Up/Blind & Buried Via PWBs
3. Cu Pillars & Posts
4. MCM/SiP Advances
5. Module Stacking Origami Flex Packages
6. Package on Package (PoP) Shaped Circuits
7. Thru Si Vias (TSV)
8. Emerging Technologies
9. Advanced Connectors
10. Embedded Assembly (Passive & Active)
11. Interposer Technologies (Si, Glass, etc.)
12. Thermal Management
13. Printed Electronics
14. Wearable Electronics
15. Structural Electronics
16. Green Electronics
17. Environmental Impact Analysis
18. Green Manufacturing (Pb/Halogen-free, etc.)
19. Large Area/Module Assembly
20. Photovoltaics
21. Power Control/Conversion/Distribution
22. Power Packaging
23. Solar Thermal Conversion
24. High Performance Low I/O
25. Chip on Glass (CoG)
26. Compact Florescent Systems
27. Display Drivers
28. Flat Panel Processes
29. LED Packaging & Assembly
30. Lighting & Displays OLED Developments
31. MEMS/MOEMS
32. Material Advances
33. Connections (Adhesives, Solders, etc.)
34. Integrated Passive Devices
35. Interconnect Taxonomy
36. Interface Metallurgy (FC, WB, TAB, Pb Free Solder, etc.)
37. Phosphors & Light Absorption
38. Thermal Interface Materials (TIMs)
39. Thin & Thick Film Systems
40. Strategic Direction/ Industry Roadmaps
41. Economics & Cost Analysis
42. Health & Prognostics
43. Manufacturing Management & Control
44. Penetration Strategies
45. Supply Chain & Operations Management
46. Technology Drivers
47. Trends, Forecasts & Roadmaps
48. Reliability, Health/Prognostics
49. Failure Analysis
50. Quality Assessment
51. Reliability Physics
52. Test & Measurement
53. Yield Projection
54. Nanotechnology
55. Materials
56. Processes & Handling