In 2015, the International Interconnect Technology Conference (IITC) will be held in conjunction with the Materials for Advanced Metallization (MAM) Conference in Grenoble, France. The 18th annual IITC is sponsored by the IEEE Electron Devices Society as a premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications. MAM 2015 will be the 24th in a conference series devoted to research on materials properties and interactions of interconnect and silicide materials. IITC/MAM has announced a Call for Papers for work describing innovative developments in the critically important field of interconnections for electronic systems. The conference seeks papers on all aspects of interconnects for device, circuit board and system-level applications. The deadline for submission of abstracts is January 16, 2015. IITC/MAM 2015 will be held May 18–21, 2015 at the Minatec Campus in Grenoble, France. The conference attracts professionals from industry, academia, and national laboratories in semiconductor processing, interconnect design, and equipment development. The conference will be preceded by a Workshop on Monday, May 18, 2015. Details will be made available closer to the conference date.