Over the past eighteen years, this workshop has evolved into a forum of exchange on the latest research and developments on innovative schemes for signal and power integrity, and in the field of interconnect modeling, simulation and measurement at chip board and package levels. The workshop is also meant to bring together developers and researchers from industry and academia in order to encourage cooperation. In view of last year’s success, the Committee is looking forward to the 19th Edition which will convene in Berlin, Germany. The symposium will include both oral and poster sessions. A number of prominent experts will be giving tutorials on areas of emerging interest. The Conference Proceedings will be published with an ISBN and will appear in IEEE Xplore. On this website you can find all information regarding the 19th IEEE Workshop on Signal and Power Integrity. It is our pleasure to invite you to the conference and we look forward to meeting you in Berlin!