Following the sucess of RaMP in Edinburgh in 2012 and San Diego in 2014, IMAPS-UK in partnership with IMAPS-US & IMAPS-Europe is pleased to announce RaMP 2015, a one-day Conference on the topic of Packaging of RF and Microwave devices, hosted at the Weetwood Hall Conference Centre, Leeds, United Kingdom. In addition, there is an “RF Design & Test Workshop” hosted by the University of Leeds and sponsored by Keysight Technologies on the 15th April, which delegates of RaMP can also register to attend. RF components and systems present significant and unique challenges. Careful considerations over substrate, materials and processes are required in order to meet cost, power, thermal, signal integrity, operation and performance specifications. The continual requirements to improve these parameters as well as the introduction of novel techniques and applications at ever expanding frequency ranges are putting increasing demands on design and packaging engineers. This seminar will bring together engineering and scientific experts from the worlds of academia and industry to discuss the latest RF and microwave packaging technologies and applications as well as a platform to highlight current commercial issue and needs.