Papers are requested on the following topics: · Quality and Reliability Assessment Techniques and Methods for Devices and Systems · Physical Modeling and Simulation for Reliability Prediction · Advanced Failure Analysis: Defect Detection and Analysis · Failure Mechanisms of Advanced Processes and Materials · Failure analysis and Reliability of Advanced and Nanoscale Electronics · Focused Ion Beam Processes (EFUG) · Power Devices Reliability · Packaging and Assembly Reliability · Organic electronics: OLED, Electronic Ink, TFT · 3D Metallization · Nano-electronics, Nano-electronic Materials for Solid State Devices, Solar Cells and Display · Photonics, Optoelectronics · Bio-engineering, Bio-electronics, Bio-sensors, Nano-Bio-technologies