The THERMINIC Workshop is an annual event that makes it possible for researchers from around the world to discuss essential and emerging thermal questions and best practices in the field of microelectronics. The growing power dissipation and mobility of packaged microsystems raise new thermal challenges in the near horizon, making regular discussions among experts in these fields highly desirable. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of a whole system. Thermal performance of a cooling solution is only one side of the medal. Thermo-mechanical reliability is the other. Increasing complexity of integrated systems in terms of materials, processes and interfaces requires design for reliability. Therefore, in addition to “traditional” thermal management, THERMINIC addresses stress and thermal-stress-related reliability issues. These challenges, faced in various nano-, micro- and power-electronic applications, are of significant importance and thus interest to the engineering community engaged in the field of thermal phenomena in “high-tech” systems. The Workshop is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society, by CMP, Fraunhofer ENAS, AMIC, TU Chemnitz and by Lausitz University of Applied Sciences.