About Components, Circuits, Devices and Systems; Computing and Processing; Photonics and Electrooptics; Power, Energy and Industry Applications
Keywords:Microelectronics,Gyroscopes And Microelectromechanical (mems) Sensors,Computer simulation,Materials reliability,Computational modeling,Reliability Modeling,3d-integration Packaging Technologies,Components, packaging, and manufacturing technology,Packaging And Interconnections,
Scope:microelectronics, thermo-mechanical simulation
Sponsor Type:1; 9
Willem van Driel (Signify, The Netherlands)
Andersson, D. R. IVF – Sweden
Bailey, C. University of Greenwich – UK
Calabretta, M. STM – Italy
Chiang, K. National Tsing Hua University/ITRI – Taiwan
Corigliano, A. Politecnico di Milano – Italy
Dasgupta, Abhijit, University of Maryland – USA
Dijk, van, Marius, Fraunhofer Institute IZM – Germany
Driel, van W., Signify – The Netherlands
Dudek, R. Fraunhofer Institute ENAS – Germany
Elata, David, Technion – Israel
Eveloy, V. The Petroleum Institute -UAE
Fan, X.J. Lamar University – USA
Frémont, H. IMS Université Bordeaux, France
Gao, Feng, Northwestern University, Evanston, IL, USA
García Martínez, Yamila, Catalan Institute of Nanoscience & Nanotechnology, Barcelona – Spain
Gonzalez, M. IMEC – Belgium
Hanreich, G. Vienna University of Technology – Austria
Iwamoto, N. Honeywell – USA
Jansen, K. TU Delft – The Netherlands
Koh, S., Huawei, China
Lall, P. Auburn University
Lee, R. Hong Kong Univ. of Science & Technology – China
Lenczner, M. FEMTO-ST Institute / Time-Frequency – France
Liu, Y. Fairchild Semiconductor -USA
Madenci, E. University of Arizona – USA
Messina, Angelo Alberto STM – Italy
Nabi Aharon, Rafael – Israel
Noritake, Chikage, DENSO CORPORATION – Japan
Pape, H. consultant – Germany
Perpinya, X, Centro Nacional de Microelectrónica – Spain
Plaza, J.A., Centro Nacional de Microelectrónica – Spain
Poshtan, E. Robert Bosch – Germany
Rantala, J. Nokia – Finland
Rochus, V. IMEC – Belgium
Rogers, P. The Petroleum Institute – UAE
Schwarz, B. Siemens – Germany
Rejaei, B., Delft University of Technology – The Netherlands
Rovitto, M., STMicroelectronics – Italy
Rzepka, S. Fraunhofer ENAS – Germany
Sabry, M.N. Université Française d’Egypte – Egypt
Sitaraman, S. K. Georgia Tech – USA
Vandevelde, B., IMEC – Belgium
van Dijk, M., Fraunhofer IZM Berlin – Germany
van Soestbergen, M., NXP Semiconductors – The Netherlands
Vellvehi, M.H., Centre Nacional de Microelectrònica (CNM) – Spain
Vinciguerra, V., STMicroelectronics Catania – Italy
Wang, Bo Ping, Univ. of Texas at Arlington – USA
Wiese, S. Saarland University – Germany
Yang, D., Guilin University, China
Zhang, Guang-Ping, Shenyang National Laboratory for Materials Science/ Institute of Metal Research (IMR), Chinese Academy of Sciences – China
Zhang, G.Q. Philips Lighting, Delft University of Technology -The Netherlands
Zhong Zhaowei, Nanyang Technology University – Singapore
Zhou, J. Lamar University – USA
04月07日
2024
04月10日
2024
摘要截稿日期
摘要录用通知日期
注册截止日期
2018年04月15日 法国
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems2017年04月02日 德国 Dresden
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems2016年04月17日 法国 Montpellier, France
2016年第17届热,机械和多物理场仿真与微电子和微系统实验国际会议2015年04月19日 美国
2015年第16届微电子与微系统散热,机械和多物理模拟和实验国际会议
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