活动简介
AboutBioengineering; Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics
Keywords:modeling and simulation,photonics and sensor technology,MEMS technology,process and fabrication,packaging technology and manufacturing,failure analysis and reliability,material and devices,Nanoelectronics,Device Physics & Characterization,Microwave Device and MMIC,Photonics Technology,Lasers LED,Bioelectronics,Solar Cells,IC Packaging and Testing,VLSI Design,Process Technology (CMOS, Bipolar, BiCMOS, GaAs , etc),Microelectronics Application in Product Development,ElectrHeterogenous Integration
Scope:Over the last twenty-four years, RSM conference series has become the prominent international forum on semiconductor electronics embracing all aspects of the semiconductor technology from circuit device, modeling and simulation , photonics and sensor technology , MEMS technology, process and fabrication , packaging technology and manufacturing, failure analysis and reliability, material and devices and nanoelectronics. Registered and presented paper will be submitted for inclusion in IEEEXplore database.
Sponsor Type:3; 5
征稿信息
留言
验证码 看不清楚,更换一张
全部留言
重要日期
  • 会议日期

    08月28日

    2023

    08月30日

    2023

  • 08月30日 2023

    注册截止日期

移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询