Circuits and systems for AI Deep learning/machine learning/AI algorithms Tools/platforms for AI Architecture for AI computing Hardware/software co-design and design automation for AI systems Advanced neural network design Neuromorphic circuits, processors, and systems and their applications Emerging applications: Internet-of-things, healthcare, smart factories, environment Emerging devices and materials for AI Computer vision algorithms and architectures Recommendation system, language/text processing Autonomous/unmanned vehicles and drone Robotics and automation Metaverse and AR/VR Deep learning/machine learning for Future Wireless Communications.
Sponsor Type:1
Honorary Co-Chairs
·Qionghai Dai,Tsinghua University,China
General Co-Chairs
·Mohamad Sawan,Westlake University,China
·Shao-Jun Wei,Tsinghua University,China
Technical Program Co-Chairs
.Yong Lian,York UniversityCanada
.Yen-Kuang Chen,Princeton Al GroupUSA
·Abe Elfadel, Khalifa University,UAE
Topics of Interest Include but not Limited to:
■ Circuits and systems for AI
■ Deep learning/machine learning/AI algorithms
■ Tools/platforms for AI
■ Architecture for AI computing
■ Hardware/software co-design and design automation for AI systems
■ Advanced neural network design
■ Neuromorphic circuits, processors, and systems and their applications
■ Emerging applications: Internet-of-things, healthcare, smart factories, environment
■ Emerging devices and materials for AI
■ Computer vision algorithms and architectures
■ Recommendation system, language/text processing
■ Autonomous/unmanned vehicles and drone
■ Robotics and automation
■ Metaverse and AR/VR
■ Deep learning/machine learning for Future Wireless Communications
06月11日
2023
06月13日
2023
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