AboutComponents, Circuits, Devices and Systems; Computing and Processing; Signal Processing and Analysis
Keywords:Testing,Design for testability,Built-in self-test,System Level Testing,Automatic test pattern generation,Integrated circuit testing,Memory Testing And Built-in Self-test,Automatic Test Equipment,Test data compression,Security,Measurement,Fault Detection,Fault diagnosis,Fault tolerance,Data Compression,Integrated circuit yield,
Scope:Design Validation and Debug, Hardware Oriented Security, ATE Design, Analog and Mixed-Signal Test, RF Test, High-Speed I/O Test, Fault Modeling and Simulation, ATPG (Automatic Test Pattern Generation), Design for Testability, Built-In Self-Test, Delay Test, System-on-Chip Test, Test Compression, Test Methods for Low-Power Circuits, Power-Aware and/or Thermal-Aware Test, Memory Test/Diagnosis/Repair, Fault Diagnosis and Failure Analysis, Test Methods for Emerging Devices, MEMS Test, Sensor Test, CPU/GPU Test, Automotive IC Test, Test Methods for Internet of Things, Online Test, On-Chip Measurement, Reliability Issues, SiP, 2.5D, and 3D IC Test, Interconnect Test, Test Standards, Test Economics, Fault Tolerance, Reconfigurable System Test, Board-Level Testing and Diagnosis, Yield Analysis and Learning
Sponsor Type:1; 1; 9