活动简介

Jointly sponsored by ACM and IEEE, ICCAD is the premier forum to explore the new challenges, present leading-edge innovative solutions, and identify emerging technologies in the electronic design automation research areas. ICCAD covers the full range of CAD topics – from device and circuit-level up through system-level, as well as post-CMOS design. ICCAD has a long-standing tradition of producing a cutting-edge, innovative technical program for attendees. The 41st edition of the conference to be held in San Diego, California, USA from 29 October-3 November 2022 will be no different! As the worldwide COVID-19 pandemic situations continues to evolve, an online registration option will be available for presenters and participants who are unable to attend in person due to travel restrictions.

组委会

General Chair

Tulika Mitra

Past Chair

Rolf Drechsler

Program Chair

Evangeline Young

Vice Program Chair

Jinjun Xiong,University at Buffalo (UB)

Tutorial & Special Session Chair

Robert Wille,Johannes Kepler University Linz

ACM SIGDA Representative

Yiyu Shi,Notre Dame University

Asian Representative

Takashi Sato,Graduate School of Informatics, Kyoto

European Representative

Ulf Schlichtmann,Technical University of Munich

Industry Liaison

Ismail S. K. Bustany,Xilinx

CEDA Representative

Tsung-Yi Ho,National Tsing Hua University

征稿信息

重要日期

2022-05-16
摘要截稿日期
2022-05-23
初稿截稿日期
2022-07-21
初稿录用日期
2022-08-15
终稿截稿日期

征稿范围

Original technical submissions on, but not limited to, the following topics are invited:

SYSTEM-LEVEL CAD

1.1 System Design

System-level specification, modeling, simulation, design flows

System-level issues for 3D integration

System-level design case studies and applications

HW/SW co-design, co-simulation, co-optimization, and co-exploration, platforms for emulation and rapid prototyping

Micro-architectural transformation

Multi-/many-core processor, GPU and heterogeneous SoC

Memory and storage architecture and system synthesis

System communication architecture, Network-on-chip design

Modeling, simulation, high-level synthesis, power/performance analysis, programming of heterogeneous computing platforms

Application driven system design for big data

Analysis and optimization of data centers

1.2 Embedded, Cyber-Physical (CPS), IoT

Systems and Software

AI and machine learning for embedded systems

HW/SW co-design for embedded systems

Compute, memory, storage, interconnect for embedded systems

Domain-specific accelerators

Energy/power management and energy harvesting

Real-time software and systems

Middleware, virtual machines, and runtime support

Dependable, safe, secure, trustworthy embedded systems

Embedded software: compilation, optimization, testing

CAD for IoT, edge and fog computing

Modeling, analysis, verification of CPS systems

Green computing (smart grid, energy, solar panels, etc.)

CAD for application domains including wearables, health care, autonomous systems, smart cities

1.3 Neural Networks and Deep Learning

Hardware and architecture for neural networks

Compilers for deep neural networks

Design method for learning on a chip

System-level design for (deep) neural computing

Neural network acceleration including GPU and ASICs

Safe and secure machine learning

Hardware accelerators for Artificial Intelligence

1.4 Reconfigurable Computing

Novel reconfigurable architectures (FPGA, CGRA, etc.)

Neural network acceleration on reconfigurable accelerators

High-level synthesis on reconfigurable architectures

Compilers for reconfigurable architectures

Reconfigurable fabric security

HW/SW prototyping and emulation on FPGAs

Post-synthesis optimization for FPGAs

FPGA-based prototyping for analog, mixed-signal, RF systems

1.5 Hardware Security, Security Architecture and Systems

Hardware Trojans, side-channel attacks, fault attacks and countermeasures

New physical attack vectors or methods for ASICs

Nano electronic security

Hardware-based security (CAD for PUF’s, RNG, AES etc.)

Split Manufacturing for security

Supply chain security and anti-counterfeiting

Artificial Intelligence for attack prevention systems

Design and CAD for security

Security implications of CAD

Trusted execution environments

Privacy-preserving computation

Cloud Computing data security

Sensor network security

1.6 Low Power and Approximate Computing in System Design

Power and thermal estimation, analysis, optimization, and management techniques for hardware and software systems

Energy- and thermal-aware application mapping and scheduling

Energy- and thermal-aware architectures, algorithms

Energy- and thermal-aware dark silicon system design

Hardware techniques for approximate/stochastic computing

SYNTHESIS, VERIFICATION, PHYSICAL DESIGN, ANALYSIS, SIMULATION, AND MODELING

2.1 High-Level, Behavioral, and Logic Synthesis and Optimization

High-level/Behavioral/Logic synthesis

Technology-independent optimization and technology mapping

Functional and logic timing ECO (engineering change order)

Resource scheduling, allocation, and synthesis

Interaction between logic synthesis and physical design

2.2 Testing, Validation, Simulation, and Verification

High-level/Behavioral/Logic modeling, validation, simulation

Formal, semi-formal, and assertion-based verification

Equivalence and property checking

Emulation and hardware simulation/acceleration

Post-silicon validation and debug

Digital fault modeling and simulation

Delay, current-based, low-power test

ATPG, BIST, DFT, and compression

Memory test and repair

Core, board, system, and 3D IC test

2.3 Cell-Library Design, Partitioning, Floorplanning, Placement

Cell-library design and optimization

Transistor and gate sizing

High-level physical design and synthesis

Estimation and hierarchy management

2D and 3D partitioning, floorplanning, and placement

Post-placement optimization

Buffer insertion and interconnect planning

2.4 Clock Network Synthesis, Routing, and Post-Layout Optimization and Verification

2D and 3D clock network synthesis

2D and 3D global and detailed routing

Package-/Board-level

Chip-package-board co-design

Post-layout/-silicon optimization

Layout and routing issues for optical interconnects

2.5 Design for Manufacturability and Design for Reliability

Process technology characterization, extraction, and modeling

CAD for design/manufacturing interfaces

CAD for reticle enhancement and lithography-related design

Variability analysis and statistical design and optimization

Yield estimation and design for yield

Physical verification and design rule checking

Machine learning for smart manufacturing and process control

Analysis and optimization for device-level reliability issues

Analysis optimization for interconnect reliability issues

Reliability issues related to soft errors

Design for resilience and robustness

2.6 Timing, Power and Signal Integrity Analysis and Optimization

Deterministic and statistical static timing analysis, optimization

Power and leakage analysis and optimization

Circuit and interconnect-level low power design issues

Power/ground network analysis and synthesis

Signal integrity analysis and optimization

2.7 CAD for Analog/Mixed-Signal/RF and Multi-Domain Modeling

Analog, mixed-signal, and RF noise modeling, simulation, test

Electromagnetic simulation and optimization

Device, interconnect and circuit extraction and simulation

Behavior modeling of devices and interconnect

Package modeling and analysis

Modeling of complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.)

CAD FOR EMERGING TECHNOLOGIES, PARADIGMS

3.1 Bio-inspired and Neuromorphic Computing, Biological Systems and Electronics, and New  Computing Paradigms

Network and neuron models

Devices and hardware for neuromorphic computing

Non-von Neumann architectures

PEvent or spike-based hardware systems

CAD for biological computing systems

CAD for synthetic biology

CAD for bio-electronic devices, bio-sensors, MEMS Systems

3.2 Nanoscale and Post-CMOS Systems

 New device structures and process technologies

New memory technologies (flash, PCM, STT-RAM, memristor)

Nanotechnologies, nanowires, nanotubes, graphene, etc.

Quantum computing

CAD for mixed-domain (semiconductor, nanoelectronic, MEMS, and electro-optical) devices, circuits, and systems

CAD for nanophotonics and optical devices/ communication

DFM and reliability issues for emerging devices (3D, Nanophotonics, non-volatile logic/memory, etc.)

Device, interconnect and circuit extraction and simulation

Behavior modeling of devices and interconnect

Package modeling and analysis

Modeling of complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.)

作者指南

Authors are asked to submit their work in two stages. In stage one (abstract submission), a title, abstract, and a list of all co-authors must be submitted via the ICCAD web submission site. In stage two (paper submission), the paper itself is submitted whereby the submitted abstract of stage one can still be modified. Authors are responsible for ensuring that their paper submission meets all guidelines, and that the PDF is readable.

Regular papers will be reviewed as finished papers; preliminary submissions will be at a disadvantage. Research papers with open-source software are highly encouraged where the software will be made publicly available (via GitHub or similar) with the camera-ready version if the paper has been accepted. For protecting the authors’ identities in the double-blind review process, please do not include direct link to the non-anonymized software yet in the submitted paper but indicate the open-source contribution on a textural basis only. Authors wanting to share GitHub repositories may want to look into using https://anonymous.4open.science/ which is an open-source tool that helps you to quickly double-blind your repository.

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重要日期
  • 会议日期

    10月29日

    2022

    11月03日

    2022

  • 05月16日 2022

    摘要截稿日期

  • 05月23日 2022

    初稿截稿日期

  • 07月21日 2022

    初稿录用通知日期

  • 08月15日 2022

    终稿截稿日期

  • 11月03日 2022

    注册截止日期

主办单位
The IEEE Council on Electronic Design Automation (CEDA)
The IEEE Circuits and Systems Society (CASS)
The IEEE Electron Devices Society (EDS)
ACM Special Interest Group on Design Automation (SIGDA)
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