活动简介

The symposium provides state-of-the-art education on EMC, Signal Integrity and Power Integrity design and measurement techniques. The Symposium will feature technical sessions, interactive workshops/tutorials, standards sessions, experiments and demonstrations, virtual technical exhibition and virtual social networking events.

Our flagship educational program, the Clayton R Paul Global University, will take place from the 27 – 29 July. The technical program will focus on tutorials and workshops in the week 2 – 6 August and technical papers in the week 9 – 13 August, with other events throughout these two weeks including our experiments and demonstrations, panel discussions, along with our technical committee and standards committee meetings.

Sponsor Type:1

组委会

GENERAL CO-CHAIRS

Alistair Duffy
Bruce Archambeault

VICE CHAIR (EMC EUROPE & TECHNICAL PAPERS)

Dave Thomas

VICE CHAIR (OPERATIONS)

Stephen Scearce

VICE CHAIR (FINANCE)

John LaSalle

VICE SECRETARY

Kris Hatashita

TREASURER/FINANCE CO-CHAIRS

Bob Davis
Linda Dawson

TECHNICAL PROGRAM CO-CHAIRS

Sam Connor
Frank Sabath
Zhiping Yang

SIPI TPC CHAIR

Jun Fan

SPECIAL SESSIONS CO-CHAIRS

Ana Vukovic
Louann Miekodaj
Colin Brench

征稿信息

重要日期

2021-02-01
初稿截稿日期

征稿范围

The IEEE EMC Society’s Technical and Special Committees encompass most but not all of the possible topics of interest. These Committees are responsible for sponsoring Symposium content and reviewing papers within their scope. The Committees, their scopes, and their primary topics of interest are listed below:

TC-1 EMC Management

Personnel & Laboratory Accreditation
EMC Education
Legal Issues

TC-2 EMC Measurements

Test Instrumentation & Facilities
Measurement Techniques
Standards and Regulations

TC-3 EM Environment

EM Signal Environment
Atmospheric & Man-Made Noise
Characterization of the EM environment

TC-4 EM Interference Control

Shielding, Gasketing & Filtering
Cables and Connectors
Circuit & System EMC Analysis
Grounding
PCB Layout

TC-5 High Power Electromagnetics

ESD & Transients
EMP, IEMI & Lightning
Information Leakage
Electric Power EMC

TC-6 Spectrum Engineering

Spectrum characterization and modeling
Design for spectrally efficient systems
Adaptive interference mitigation

TC-7 Low Frequency EMC

Power Quality and Power System EMC
Conducted emissions due to Power Converters
Transportation and Electrical Vehicles
Renewables and Smart Grid
Topics for future standardization

TC-8 Aeronautics and Space EMC

Aircraft
Atmospheric environment
Drones
Spacecraft
Space environment
Launch vehicles
Missiles
Other aerospace topic

TC-9 Computational Electromagnetics

Computer Modeling and Circuit Simulation Methods
Multi-Physics Techniques, Tools and Applications
SI/PI/EMC Co-Simulation
Best Practice and Validation Methods
Surrogate Modeling and Optimization
Techniques
Design of Experiments (DoE) and Statistical Analysis

TC-10 Signal and Power Integrity

High-Speed Interconnects
Device Modeling & Characterization
Crosstalk, Jitter, Noise Coupling, BER Analysis
3D IC & TSV
Power Distribution Networks & Decoupling
SI/PI/EMI Co-Design
Simulation and Modeling Techniques
Chip-level advanced packaging
Topics for future standardization

TC-11 Nanotechnology & Advanced Materials

Nanomaterials & Nanostructures
Smart Materials
Topics for future standardization
TC-12 EMC for Emerging Wireless Technologies

EMC Planning/Testing/Specifications
Wireless Coexistence
Intra-System Interference
RF desense

SC-1 Smart Grid EMC

Renewable Generation
Grid Communications

SC-5 Power Electronics EMC

AC/DC, DC/Dc, DC/AC and AC/DC power conversion
Passive components and semiconductor devices
Automotive, aerospace, and communication systems, wireless power transfer
Medical, aviation, consumer electronics and power applications
Topics for future standardization

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重要日期
  • 会议日期

    07月27日

    2021

    08月13日

    2024

  • 02月01日 2021

    初稿截稿日期

  • 08月09日 2024

    注册截止日期

主办单位
IEEE Electromagnetic Compatibility Society
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