Specific topics include, but are not limited to, the following three main tracks and sub-areas:

1. Technology, Circuits, and Architecture

1.1. Technologies

Low-power technologies for device, interconnect, logic, memory, 2.5/3D, cooling, harvesting, sensors, optical,
printable, biomedical, battery, and alternative energy storage devices.

1.2. Circuits

Low-power digital circuits for logic, memory, reliability, clocking, power gating, resiliency, near-threshold and subthreshold, variability, and digital assist schemes; Low-power analog/mixed-signal circuits for wireless, RF, MEMS, AD/DA Converters, I/O, PLLs/DLLS, imaging, DC-DC converters, and analog assist schemes.

1.3. Logic and Architecture

Low-power logic and microarchitecture for SoC designs, processor cores (compute, graphics and other special purpose cores), cache, memory, arithmetic/Signal processing, cryptography, variability, asynchronous design, and nonconventional computing.

2. CAD, Systems, and Software

2.1. CAD Tools and Methodologies

CAD tools and methodologies for low-power and thermalaware design addressing power estimation, optimization, reliability and variation impact on power, and power-down approaches at all levels of design abstraction: physical, circuit, gate, register transfer, behavior, and algorithm.

2.2. Systems and Platforms

Low-power, power-aware, and thermal-aware system design including data-center power delivery and cooling, Platforms for SoCs, embedded systems, approximate and brain-inspired computing, Internet-of-Things (IoT), wearable computing, body-area networks, wireless sensor networks, and systemlevel power implications due to reliability and variability.

2.3. Software and Applications

Energy-efficient, energy-aware, and thermal-aware software and application design including scheduling and management, power optimizations through HW/SW interactions, and emerging software low-power applications.