The ISSE conference series is a renowned European forum for exchanging knowledge between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and micro/nanoelectronics technology and in particular electronics packaging technology. The motto of the upcoming conference event is "Advancements in Microelectronics Packaging for Harsh Environment". In the frame of a unique combination of poster exhibitions, oral paper presentations, and individual meetings senior and junior researchers from all over the world come together to discuss scientific problems and their teaching experiences as well as plan and organize international research co-operations and student exchanges in a convenient and multicultural atmosphere.
General Chair
Heinz Wohlrabe (TU Dresden, Germany)
Secretary of ISSE
Oliver Krammer (Budapest University of Technology and Economics, Hungary)
Technical Program Chair
Johann Nicolics (Vienna University of Technology, Austria)
Conference Chair
Heinz Wohlrabe (TU Dresden, Germany)
Topics of Interest:
New Materials, Components and Processes
Thermal Management
Advanced Packag ing and Interconnection Technologies
Testing, Relability and Quality Management
Process Modelling and Simulation
Environmental and Ecological Efects in Electronics Technology
Nanotechnology, Nanomaterials and Nanoelectronics
Signal Integrity and Electromagnetic Compatibility
Sensors, Actuators and Microsystems
Educational and Information Technologies in Electronics Manufacturing
Discrete and Integrated Components
05月05日
2021
05月09日
2021
摘要截稿日期
初稿截稿日期
注册截止日期
2018年05月16日 塞尔维亚
2018年第41届国际电子技术春季研讨会2017年05月10日 保加利亚 Sofia, Bulgaria
2017年第40届国际电子技术春季研讨会2016年05月18日 捷克共和国 Pilsen,Czech Republic
2016年第39届国际电子科技春季研讨会2013年05月08日 罗马尼亚
2013年第36届国际电子科技春季研讨会
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