活动简介

The ISSE conference series is a renowned European forum for exchanging knowledge between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and micro/nanoelectronics technology and in particular electronics packaging technology. The motto of the upcoming conference event is "Advancements in Microelectronics Packaging for Harsh Environment". In the frame of a unique combination of poster exhibitions, oral paper presentations, and individual meetings senior and junior researchers from all over the world come together to discuss scientific problems and their teaching experiences as well as plan and organize international research co-operations and student exchanges in a convenient and multicultural atmosphere.

组委会

General Chair    

Heinz Wohlrabe (TU Dresden, Germany)

Secretary of ISSE    

Oliver  Krammer (Budapest University of Technology and Economics, Hungary)

Technical Program Chair    

Johann Nicolics (Vienna University of Technology, Austria)

Conference Chair    

Heinz Wohlrabe (TU Dresden, Germany)
 

征稿信息

重要日期

2021-02-05
摘要截稿日期
2021-04-16
初稿截稿日期

征稿范围

Topics of Interest:

New Materials, Components and Processes
Thermal Management
Advanced Packag ing and Interconnection Technologies
Testing, Relability and Quality Management
Process Modelling and Simulation
Environmental and Ecological Efects in Electronics Technology
Nanotechnology, Nanomaterials and Nanoelectronics
Signal Integrity and Electromagnetic Compatibility
Sensors, Actuators and Microsystems
Educational and Information Technologies in Electronics Manufacturing
Discrete and Integrated Components
 

留言
验证码 看不清楚,更换一张
全部留言
重要日期
  • 会议日期

    05月05日

    2021

    05月09日

    2021

  • 02月05日 2021

    摘要截稿日期

  • 04月16日 2021

    初稿截稿日期

  • 05月09日 2021

    注册截止日期

主办单位
Dresden University of Technology IEEE Electronics Packaging Society
历届会议
移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询