报告清单

[147]An Accurate Crosstalk Evaluation and Prediction Method for SiC MOSFET Considering Nonlinear Capacitance and Stray Parameters

公开张贴报告

[146]Degradation mechanism of AlGaN/GaN high electron mobility transistors based on high temperature reverse bias stress

Meng Lu 湘潭大学

公开张贴报告

[142]Influence of CucorAl wire bonding on reliability of SiC devices

Fang Chao engineer Zhuzhou CRRC Times Semiconductor Co., Ltd.

公开张贴报告

[141]Development and applications of packaging materials for power semiconductor devices

Mingxiang Chen Huazhong University of Science and Technology (HUST)

K /K1 2021年08月26日 11:10~11:50

仅限参会人特邀报告

[137]Evaluating Switching Performance of GaN HEMT Using Analytical Modeling

Yingzhe Wu University of Electronic Science and Technology of China

公开张贴报告

[136]Evaluation of Dynamic On-Resistance of InnoGaN and its Application for High-Density Power Converters

Shan Yin Application Director Innoscience (Zhuhai) Technology Co.,Ltd

IS /IS 2021年08月27日 10:00~10:25

仅限参会人口头报告

[135]Power devices and power supply test solution

Yucai Liu Marketing Manager in Guangzhou ZHIYUAN Electronics Co., Ltd

IS /IS 2021年08月27日 10:25~10:50

仅限参会人口头报告

[134]Test Beyond JEDEC – SiC MOSFET Reliability Supplemental Tests

Ye Zhong CTO InventChip Technology Co., Ltd.

IS

仅限参会人口头报告

[133]The Latest Testing Methods and Solutions in Wide BandGap

Wanner Huang Tektronix Senior Bus Tektronix(China)Co.,Ltd.

IS /IS 2021年08月27日 10:50~11:15

仅限参会人口头报告

[132]Graphical development platform for industrial controller

Shen Su Assistant General Ma RTUNIT（Nanjing Rtunit Information Technology Co., Ltd.）

IS

仅限参会人口头报告

IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WIPDA-ASIA 2021)

[147]An Accurate Crosstalk Evaluation and Prediction Method for SiC MOSFET Considering Nonlinear Capacitance and Stray Parameters

[146]Degradation mechanism of AlGaN/GaN high electron mobility transistors based on high temperature reverse bias stress

[142]Influence of CucorAl wire bonding on reliability of SiC devices

[141]Development and applications of packaging materials for power semiconductor devices

[137]Evaluating Switching Performance of GaN HEMT Using Analytical Modeling

[136]Evaluation of Dynamic On-Resistance of InnoGaN and its Application for High-Density Power Converters

[135]Power devices and power supply test solution

[134]Test Beyond JEDEC – SiC MOSFET Reliability Supplemental Tests

[133]The Latest Testing Methods and Solutions in Wide BandGap

[132]Graphical development platform for industrial controller

重要日期

会议日期

主办单位

承办单位

联系方式

历届会议