活动简介

COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 22 is to be held in Yokohama on April 17-19, 2019.

征稿信息

重要日期

2019-02-22
初稿截稿日期

征稿范围

Contributions are solicited in the following areas:

Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.
Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.

留言
验证码 看不清楚,更换一张
全部留言
重要日期
  • 会议日期

    04月17日

    2019

    04月19日

    2019

  • 02月22日 2019

    初稿截稿日期

  • 04月19日 2019

    注册截止日期

承办单位
IEICE Electronics Society and IPSJ.
移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询