活动简介

The scope of this conference is a very focused one with specific interest in compact modeling of silicon, Gallium Nitride and other composite materials based electron devices. Verilog A based modeling and simulation of analog and Digital systems is another core area of the conference. Circuit modeling for analog and Digital IC design and its application in fabrication of deep sub micron technology based integrated circuits is a key focus area. Hence the conference is named as Modeling of Systems, Circuits and Devices.

征稿信息

重要日期

2018-10-15
初稿截稿日期
  • HiTech forum to discuss the frontiers of electron device modeling with emphasis on simulation-aware compact/SPICE models.
  • MOS-AK Meetings are organized with aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/Spice modeling and Verilog-A standardization, bring people in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD tool vendors. The topics cover all important aspects of compact model development, implementation, deployment and standardization within the main theme - frontiers of the compact modeling for nm-scale MEMS designs and CMOS/SOI circuit simulation.
  • The specific workshop goal will be to classify the most important directions for the future development of the electron device models, not limiting the discussion to compact models, but including physical, analytical and numerical models, to clearly identify areas that need further research and possible contact points between the different modeling domains. This workshop is designed for device process engineers (CMOS, SOI, BiCMOS, SiGe) who are interested in device modeling; ICs designers (RF/Analog/Mixed-Signal/SoC) and those starting in that area as well as device characterization, modeling and parameter extraction engineers. The content will be beneficial for anyone who needs to learn what is really behind the IC simulation in modern device models.

征稿范围

Topics: to be covered include the following:
  • Advances in semiconductor technologies and processing
  • Compact Modeling (CM) of the electron devices
  • Verilog-A language for CM standardization
  • New CM techniques and extraction software
  • FOSS TCAD/EDA modeling and simulation
  • CM of passive, active, sensors and actuators
  • Emerging Devices, TFT CMOS and SOI-based memory cells
  • Organic, Bio/Med devices/technology modeling
  • Microwave, RF device modeling, HV/Power device modeling
  • Nanoscale CMOS devices and circuits
  • Technology R&D reliability/ageing, DFY, DFT and IC Designs
  • Foundry/Fabless Interface Strategies
留言
验证码 看不清楚,更换一张
全部留言
重要日期
  • 会议日期

    02月25日

    2019

    02月27日

    2019

  • 10月15日 2018

    初稿截稿日期

  • 02月27日 2019

    注册截止日期

移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询