Using silicon, III-V, silicon nitride, or silicon dioxide as a materials platform to develop optoelectronic devices and/or using planar integration technology to miniaturize optoelectronic devices has been proposed and practiced for quite some time, in hoping it may bring down the cost of communication much further than any other techniques available. In the early years of this century, fast and reliable “Silicon Photonic Devices” were developed for practical usages, while the monolithic integration of electronic and photonic devices on a silicon compatible platform is remaining a challenging task. To obtain a real low cost high density data communication system, more and more research projects and technical conferences are focusing on the “Optoelectronic Integrations”, particularly on the challenging frontiers in this area.

This workshop is to provide a forum for international experts and scientists to present and discuss their forward looking views on realizing optoelectronic integration for large volume applications. About 12 invited presentations and a dinner speech, covering a variety of subjects, are scheduled for this Workshop in Beijing, China.

We are very pleased to have you join us and we look forward to a great Workshop!