IEEE Region 10 Conference 2018 TENCON 2018

活动简介

TENCON is a premier international technical conference of IEEE Region 10, which comprises 58 sections, 6 councils, 26 subsections, 663 chapters, and 1,431 student branches in the Asia Pacific region. The theme for TENCON 2018 is Intelligence Outbreak; researchers and engineers will gather from academia and industry and share their ideas and opinions on emerging issues in the fields of electrical, electronic and computer engineering as well as information technologies. Prospective authors are invited to submit a full paper with four to six pages in double-column IEEE conference format via the conference website http:// www.tencon2018.org. More information about paper format and guidelines for paper submission can be found at the conference website. The conference proceedings will be submitted to the IEEE Xplore® digital library. In addition, extended versions of selected papers will be considered for publication in journals indexed in SCI, SCI-E and Scopus. For detailed information about the indexed journals, please refer to the conference website.

组委会

Honorary Conference Chair
Kukjin Chun (2017-2018 IEEE Region 10 Director, Korea)
General Chairs
Changhyun Kim (POSTECH, Korea)

Jong Chang Yi (Hongik University, Korea)
Secretary General: Chaewoo Lee (Ajou University, Korea)
Registration Committee Chair: Sang Hyun Lee (Korea University, Korea)
Financial Committee Chair: Ji Hoon Yun (Seoul National University of Science and Technology, Korea)
Treasurer: Yongjun Park (Hanyang University, Korea)
Fund Raising Committee Chair: Gyu Sik Hong (Seoul National University, Korea)
Publicity Chair: Ki Jin Han (Dongguk University, Korea)
Publication Chair: Dongmyung Lee (Hongik University, Korea)
Local Arrangement Chairs
Kyungyun Kim (Jeju University, Korea)
Dae Gwon Jeong (Korea Aerospace University, Korea)
Exhibition Chair: Son Cheol Yu (POSTECH, Korea)

Technical Program Committee

Technical Program Committee Chair: Cheon Won Choi (Dankook University, Korea)
Keynote Sessions: Inkyu Lee (Korea University, Korea)
Special Sessions 1: Jinyoung Hwang (Korea Aerospace University, Korea)
Special Sessions 2: Sungroh Yoon (Seoul National University, Korea)
Tutorial Sessions: Hong Il Yoon (Yonsei University, Korea)
Professional Sessions: Changhyun Kim (POSTECH, Korea)
W.Y.S.L. Coordinator (WIE): JeongYon Shim (Kangnam University, Korea)
W.Y.S.L. Coordinator (YP): Albert No (Hongik University Korea)
W.Y.S.L. Coordinator (SB): Soyoung Kim (Sungkyunkwan University, Korea)
Industrial Relations: Hyuk-Jae Lee (Seoul National University, Korea)
Standards Sessions: Hyung Ho Lee (ETRI, Korea)
Track Chairs
Seong-Je Cho (Dankook University, Korea)
Sang-Il Choi (Dankook University, Korea)
Jinyoung Kim (Kwangwoon University, Korea)
Soo Chan Kim (Hankyong University, Korea)
Hyunchang Park (Dongguk University, Korea)
Oh-Soon Shin (Soongsil University, Korea)
Minkyu Song (Dongguk University, Korea)
Sang-Hun Song (Chung-Ang University, Korea)
Seokhyun Yoon (Dankook University, Korea)

Steering Committee

Kukjin CHUN (Seoul National University, Korea)
Ramakrishna KAPPAGANTU (IEEE BOD, India)
Akinori NISHIHARA (Tokyo Inst. Tech. , Japan)
Qiuqi RUAN (BJTU, China)
Toshitaka TSUDA (Waseda University, Japan)
Takao ONOYE (Osaka University, Japan)

International Advisory Committee (Partial)

Chair: Junkyoon Choi (KAIST, Korea)
Co-Chair: Chang Sung Jeong (Korea University, Korea)
Secretary: Dae Gwon Jeong (Korea Aerospace University, Korea)
Kanpur Section Chair: S N Singh (University of Technology Gorakhpur, India)
Tokyo Section Chair: Iwao Sasase (Keio University, Japan)
Daejeon Section Chair: Yong Seok Choi (ETRI, Korea)
Gwangju Section Chair: Yo Sung Ho (GIST, Korea)
Changwon Section Chair: Do Hoon Lee (Pusan National University, Korea)
Daegu Section Chair: Jee Hyun Kim (Kyungbuk National University, Korea)
MD Coordinator: Takako Hashimoto (Chiba University of Commerce, Japan)
MD Coordinator: Michael Ong (I2R, Singapore)
WIE: Madya Lee Yoot Khuan (Universiti Teknologi Mara, Malaysia)
YP: Hussain Madi (Universiti Kebangsaan Malaysia, Malaysia)
Member
Primiere Delegate of KIEE, Chelhwan Kim(Sungkyunkwan University, Korea)
President of IEIE, Joon Ki Paik(Chung-ang University, Korea)
President of OSK, Young Joo Chung(GIST, Korea)
KIEES President, Bom Son Lee(Kyung hee University, Korea)
President of KICS, Chung G, Kang(Korea University, Korea)
KIPS President, Seok Woo Nam(GIST, Korea)
President of KIISE, Yong IK Eom(Sungkyunkwan University, Korea)

征稿信息

重要日期

2018-05-21

初稿截稿日期

2018-07-23

初稿录用日期

2018-08-27

终稿截稿日期

Scope

The scope of the conference includes but not limited to the following areas:
Topics for regular sessions in TENCON 2018

Antenna and Microwave
Biomedical Engineering
Circuits and Systems
Communications and Networks
Computational Intelligence
Computer Systems
Devices, Materials and Processing
Emerging Technologies
Internet of Things
Power and Energy
Robotics and Control Systems
Sensor Technologies and Applications
Signal and Image Processing
Other Technologies

Topics for special sessions in TENCON 2018

Quantum Communications
Edge Computing
Oxide Semiconductor Based Electronic Devices
Microwave Technologies for Sensing and Communications
Smart Wearable Technologies for Healthcare, Virtual Reality, Mobile Devices and Safety
5G and Beyond
Humanitarian Technologies
Communications Security
Applications of Machine Learning in Science and Engineering
Nanostructured Semiconductors and Their Applications

Paper Submission and Publication

Prospective authors are invited to submit full paper with four to six pages in double-column IEEE conference paper format.
Information about paper format and guidelines for paper submission can be found here.
The presented papers will be published at the proceedings of IEEE TENCON 2018, which will be included in IEEE Xplore digital library.
In addition, extended versions of selected papers will be considered for publication at journals indexed in SCI, SCI-E and Scopus.

作者指南

ONLINE PAPER SUBMISSION

Prospective authors are requested to follow the instructions below for submitting papers to TENCON 2018.

Manuscript Preparation

Your manuscript must be formatted with the template for IEEE conference proceedings.
The templates in Microsoft Word and LaTeX are available. Click here here for Microsoft Word template or click here for Latex.
The length of your manuscript should be 4~6 pages.
Your manuscript should be made a PDF file to be submitted.
1. All fonts including Times New Roman should be embedded in your PDF file.
  - Note that you should remove the fonts you need to embed from ‘Never Embed’ list.
2. When you create a PDF file using Microsoft Word, please, follow the steps below.
  - Select Save as menu.
  - Choose pdf (*.pdf) under Save as type dialog box.
  - Click Option button.
  - Choose ISO 19005-1 compliant under ‘PDF option’.
  - Click Save button.

Initial Paper Submission (for Review)

Your paper should be submitted to EDAS with your login ID.
If you do not have a login ID, please, visit here to create one.
The website for paper submission is here.
When you upload your paper, please, make sure that your browser has cookies enabled.
Once you have uploaded your paper, EDAS automatically assigns a paper ID to your paper.

Final Paper Submission

If your paper is accepted, you will be asked to submit the final manuscript of your paper.
The format of final manuscript and the guideline for final paper submission will be announced later.
Note that you will also be asked to submit the IEEE electronic copyright transfer form.