活动简介

As an emerging cross-disciplinary research area, Cyber Physical System (CPS) is attracting research interests worldwide. CPS features an integration of computational and physical elements, which are capable of interacting and influencing each other. Furthermore, social systems are evolving with cyber systems and physical systems along with the popularity of online social networking. With the advent of ubiquitous sensing and networking, future social networks incorporate cyber-physical interactions, which are associated social attributes.
The 2018 IEEE International Conference on Cyber, Physical and Social Computing (CPSCom 2018) will provide a high-profile, leading-edge forum for researchers, engineers, and practitioners to present state-of-art advances and innovations in theoretical foundations, systems, infrastructure, tools, testbeds, and applications for CPSCom, as well as to identify emerging research topics and define the future. We seek submissions of papers which describe new techniques, introduce innovative ideas, propose new research directions and discuss solutions for cyber-enabled new physical and social systems.

组委会

General Chairs 
•   Shiyan Hu, Michigan Technological University, USA
•   Tei-Wei Kuo, National Taiwan University, Taiwan
•   Vincenzo Piuri, Università. degli studi di Milano, Italy 
Program Chairs
•   Haibo He, University of Rhode Island, USA
•   Zhen Ni, South Dakota State University, USA
•   Nian Zhang, University of District of Columbia, USA
•   Stefano Squartini, Marche Polytechnic, Italy
Executive Chair
•   Xiaokang Wang, St. Francis Xavier University, Canada
Workshop and Special Session Chairs
•   Helen Li, Duke University, USA
•   Xiang Chen, George Mason University, USA
•   Jason Xue, City University of Hong Kong, China
Publicity Chair
•   Bei Yu, Chinese University of Hong Kong, China
Web Chair
•   Zihao Jiang, St. Francis Xavier University, Canada
Steering Chairs
•   Jianhua Ma, Hosei University, Japan
•   Laurence T. Yang, St. Francis Xavier University, Canada

Program Committee

•   Novais Paulo, Universidade do Minho, Portugal
•   Dana Petcu, West University of Timisoara, Romania
•   Juan Manuel Corchado Rodrguez, University of Salamanca, Spain
•   Zhibo Pang, ABB Company, Sweden
•   Julio Sahuquillo, Universidad Politecnica de Valencia, Spain
•   Joanna Siebert, Hong Kong Polytechnic University, Hong Kong
•   Francois Siewe, De Montfort University, UK
•   Chiu Chiang Tan, Temple University, USA
•   Tim Hansen, South Dakota State University, USA
•   Reinaldo Tonkoski, South Dakota State University, USA
•   Ing-Ray Chen, Virginia Tech, USA
•   Thabet Kacem, University of the District of Columbia, USA
•   Shakir James, University of the District of Columbia, USA
•   Junwhan Kim, University of the District of Columbia, USA
•   Emanuele Principi, Università Politecnica delle Marche, Italy
•   Susanna Spinsante, Università Politecnica delle Marche, Italy
•   Chengdong Li, Shandong Jianzhu University, China
•   Paul Kaufmann, University of Paderborn, Germany
•   Filipe Saraiva, Universidade Federal do Pará, Brazil
•   Mauro Tucci, University of Pisa, Italy
•   Siyang Lu, University of Central Floriad, USA
•   Hu Zhu, Nanjing University of Posts and Telecommunications, China
•   Kehua Guo, Central South University, China
•   Hao Wang, Norwegian University of Science and Technology, Norway
•   Lianyong Qi, Qufu Normal University, China
•   Xuyun Zhang, The University of Auckland, New Zealand
•   Xingang Liu, University of Electronic Science and Technology of China, China
•   Chen Yu, Huazhong University of Science and Technology, China
•   Deze Zeng, China University of Geosciences, China
•   Peng Li, University of Aizu, Japan
•   Xiongjun Zhang, Central China Normal University, China
•   Lei Ren, Beihang University, China
•   Yuhui Deng, Jinan University, China
•   Miaoqing Huang, University of Arkansas, USA
•   Dakai Zhu, University of Texas at San Antonio, USA
•   Chin-Feng Lai, National Cheng Kung University, Taiwan
•   Rodrigo N. Calheiros, Engineering and Mathematics, Western Sydney University, Australia

征稿信息

重要日期

2018-04-15
初稿截稿日期
2018-05-20
初稿录用日期
2018-06-11
终稿截稿日期

Track 1: Systems & Design
  • Efficient architectures
  • Low power systems
  • Real-time systems
  • Wearable devices management
  • System-level design methodology
  • Embedded hardware and software
  • Hyper-connected smart devices
  • Embedded middleware design
Track 2: Data & Services
  • Data processing and AI
  • Data-driven services in CPSCom
  • Data mining platforms for CPSCom
  • Cloud/edge computing & commun
  • QoS in CPSCom
  • Distributed computing
  • Smart services platform
  • Energy efficient computing
Track 3: Networks & Communs
  • Wireless sensor networks
  • Radio frequency identification
  • Sensor network and communications
  • 5G oriented sensing systems
  • Communications in edge computing
  • Machine-to-machine communicationss
  • Energy efficient in wireless networks
  • Learning techniques in smart sensing
Track 4: Technologies & Applics
  • Narrow band Internet-of-Things
  • E-Health in CPSCom 
  • Software defined services
  • Smart City
  • Privacy and privacy-preserving systems
  • Digital clone
  • Ubiquitous intelligence and application
  • Industrial Internet of Things

作者指南

Paper Submission

Main conference papers are limited to 8 pages (full papers), or 4 pages (short papers), following the IEEE proceedings format, and are to be submitted as PDF.
Paper Publication

Accepted conference papers will be published by IEEE (IEEE-DL and EI indexed). At least one author of each accepted paper is required to register and present their work at the conference; otherwise the paper will not be included in the proceedings. Selected papers, after further extensions and revisions, will be recommended to journal special issues. More details at the conference website: http://cse.stfx.ca/~CPSCom2018/

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重要日期
  • 会议日期

    07月30日

    2018

    08月03日

    2018

  • 04月15日 2018

    初稿截稿日期

  • 05月20日 2018

    初稿录用通知日期

  • 06月11日 2018

    终稿截稿日期

  • 08月03日 2018

    注册截止日期

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