In recent years, significant efforts have been devoted on heterogeneous integration technologies. Cost and reliability issues delayed the availability and easy access of these technologies. However, there has been a wide use of these technologies for consumer electronics in these days. Specifically, FOWLP technologies providing very low parasitics and high level of integration became the key technology for both low and high volume applications. In parallel, latest developments on both highly scaled CMOS and SiGe BiCMOS technologies allow the circuits to operate at mm-wave and sub-THz frequencies. Successful circuit demonstrations up to 500 GHz paved the way for new applications at mm wave frequencies. However, packaging of these circuits with very low parasitics and low form factor seem to be the main challenge these days. In this workshop, the technology and application aspects of 3D/FOWLP technologies will be discussed. The available technologies will be presented by research institutes and industrial foundries. The successful packaged circuit examples will also be presented with some future need of the industry. Lastly, Multi-Project-Wafer (MPW) access of different available technologies for research and prototyping will also be discussed.