活动简介

Professors Shoji Tanaka and Walter Kosonocky, founders of the Symposia, first organized the VLSI Technology Symposium in 1981 with the hope of offering an opportunity for world's top technologists to engage in an open exchange of ideas on what was quickly becoming a revolution in the world's industrial capability. Since then, the Symposium has been held annually and has grown to be an important and valuable event for people working in the VLSI business. The presentation of high-quality papers has made it possible for attendees to learn about new directions in the development of VLSI technology. The friendly atmosphere has made this an enjoyable learning experience.

The Symposium on VLSI Technology has alternated each year between sites in US and Japan. In 1987, the first Symposium on VLSI Circuits was held in conjunction with the Technology Symposium in recognition of the growing interest to provide the same small but intense and open forum for discussing circuit and system implementations. Since then, this annual meeting has increased its value over the past 30 years. We are confident that so many new technologies and circuits were introduced in the past Symposia and thus have contributed to the prosperity of the world. Its sponsors continue to be the IEEE Electron Devices Society and Solid-State Circuits Society, and the Japan Society of Applied Physics in cooperation with the Institute of Electronics, Information and Communication Engineers.

For many reasons, these meetings have remained linked for the past years to provide opportunities for technology people and circuit and system designers to interact with each other. These interactions are augmented with short courses, invited speakers and several evening rump sessions. In recognition of the efforts of organizers, authors and participants to make the Symposia successful, there is ample banquet and entertainment prearranged.

The 2016 meeting was held in Honolulu, Hawaii. This year it will be returning to the RIHGA Royal Hotel in Kyoto, Japan in June of 2017.

征稿信息

重要日期

2017-01-23
初稿截稿日期
2017-03-20
初稿录用日期

征稿范围

  • Innovative Technology Directions, see inset in the right column

  • IoT Systems and Technologies including ultra-low power technologies; heterogeneous integration; wearable devices, sensors, display, connectivity; power management; digital /analog, microcontrollers and application processors.

  • Stand-Alone and Embedded Memories including technology and reliability for DRAM, SRAM, (3D-)NAND, MRAM, PCRAM, ReRAM and other memories.

  • CMOS Technology, Microprocessors and SoCs including scaling, VLSI manufacturing concepts, and yield optimization.

  • RF / Analog / Digital Technologies for mixed-signal SoC; RF front end;analog, mixed-signal, I/O, high-voltage, imaging, MEMS, integrated sensors.

  • Process and Material Technologies including advanced transistor process and architecture, modeling and reliability; alternate channel; advanced lithography, high-density patterning; SOI and III-V technologies; photonics;local interconnects and Cu / optical interconnects scaling.

  • Packaging Technologies and System-in-Package (SiP) including through-silicon-vias (TSVs), power and thermal management, inter-chip communication,3D-system integration,and yield & test issues.

  • Photonics Technology and Beyond CMOS Devices

  • Innovative system directions, see in the right column

  • Digital circuits, processors and architectures, including circuits and techniques for standalone and embedded processors

  • Memory circuits, architectures and interfaces for volatile and nonvolatile memories, including emerging technologies

  • Frequency generation and clock circuits for high-speed digital and mixedsignal applications

  • Analog and mixed-signal circuit, including amplifiers, filters, and data converters

  • Wireline receivers and transmitters, including circuits for interchip and longreach applications

  • Wireless receivers and transmitters, including circuits for WAN, LAN, PAN,BAN inter-chip and mm-wave applications

  • Power conversion circuits, including those for battery management, voltage regulation, and energy harvesting

  • Imagers, displays, sensors, VLSI circuits and systems, including biomedical,healthcare and wearable applications

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重要日期

  • 会议日期

    06月05日

    2017

    至

    06月08日

    2017

  • 01月23日 2017

    初稿截稿日期

  • 03月20日 2017

    初稿录用通知日期

  • 06月08日 2017

    注册截止日期

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Japan Society of Applied Physics - JSAP
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